Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents

Autores
Azpeitia, Leticia Anahi; Gervasi, Claudio; Bolzán, Agustín Eduardo
Año de publicación
2023
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The electrodeposition process of tin films on copper electrodes in ethaline and reline deep eutectic solvents (DES) was studied in the 303 – 353 K range. Voltammetric data indicate the presence of underpotential and overpotential electrodeposition processes. While the former occurs under surface-reaction control, the latter proceeds under mass transport control. Electrochemical impedance spectroscopy shows two capacitive contributions during the underpotential process and a single capacitive contribution at high frequencies and a Warburg contribution at low frequencies, when the electrodeposition process takes place in the overpotential region. Tin deposits obtained in ethaline exhibit blunt particles with ordered structures whereas in reline facetted particles with no preferential order are observed as electrodeposition time is increased. The electrocrystallization mechanism under overpotential conditions in ethaline and reline corresponds to an instantaneous nucleation and a 3D growth process. For underpotential conditions in ethaline, an instantaneous nucleation and 2D growth coupled to an adsorption process occurs. XRD spectra shows the formation of Cu3Sn and Cu6Sn5 intermetallics due to the diffusion of Sn atoms into the Cu lattice during the electrodeposition process. From rotating disk electrode measurements, the diffusion coefficient of Sn(II) ions in both DES at different temperatures, and the diffusion activation energy, were determined.
Fil: Azpeitia, Leticia Anahi. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; Argentina
Fil: Gervasi, Claudio. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; Argentina
Fil: Bolzán, Agustín Eduardo. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; Argentina
Materia
COPPER ELECTRODES
DEEP EUTECTIC SOLVENTS
ELECTROCHEMICAL BEHAVIOUR
FILM GROWTH
TIN ELECTRODEPOSITION
Nivel de accesibilidad
acceso embargado
Condiciones de uso
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/220161
Acceder
id CONICETDig_504d806bdf3dac9cb5b64e333e61d15d
oai_identifier_str oai:ri.conicet.gov.ar:11336/220161
network_acronym_str CONICETDig
repository_id_str 3498
network_name_str CONICET Digital (CONICET)
spelling Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solventsAzpeitia, Leticia AnahiGervasi, ClaudioBolzán, Agustín EduardoCOPPER ELECTRODESDEEP EUTECTIC SOLVENTSELECTROCHEMICAL BEHAVIOURFILM GROWTHTIN ELECTRODEPOSITIONhttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2The electrodeposition process of tin films on copper electrodes in ethaline and reline deep eutectic solvents (DES) was studied in the 303 – 353 K range. Voltammetric data indicate the presence of underpotential and overpotential electrodeposition processes. While the former occurs under surface-reaction control, the latter proceeds under mass transport control. Electrochemical impedance spectroscopy shows two capacitive contributions during the underpotential process and a single capacitive contribution at high frequencies and a Warburg contribution at low frequencies, when the electrodeposition process takes place in the overpotential region. Tin deposits obtained in ethaline exhibit blunt particles with ordered structures whereas in reline facetted particles with no preferential order are observed as electrodeposition time is increased. The electrocrystallization mechanism under overpotential conditions in ethaline and reline corresponds to an instantaneous nucleation and a 3D growth process. For underpotential conditions in ethaline, an instantaneous nucleation and 2D growth coupled to an adsorption process occurs. XRD spectra shows the formation of Cu3Sn and Cu6Sn5 intermetallics due to the diffusion of Sn atoms into the Cu lattice during the electrodeposition process. From rotating disk electrode measurements, the diffusion coefficient of Sn(II) ions in both DES at different temperatures, and the diffusion activation energy, were determined.Fil: Azpeitia, Leticia Anahi. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; ArgentinaFil: Gervasi, Claudio. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; ArgentinaFil: Bolzán, Agustín Eduardo. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; ArgentinaElsevier Science SA2023-09info:eu-repo/date/embargoEnd/2024-03-13info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/220161Azpeitia, Leticia Anahi; Gervasi, Claudio; Bolzán, Agustín Eduardo; Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents; Elsevier Science SA; Journal of Electroanalytical Chemistry; 944; 9-2023; 1-341572-6657CONICET DigitalCONICETenginfo:eu-repo/semantics/altIdentifier/url/https://linkinghub.elsevier.com/retrieve/pii/S1572665723004976info:eu-repo/semantics/altIdentifier/doi/10.1016/j.jelechem.2023.117637info:eu-repo/semantics/embargoedAccesshttps://creativecommons.org/licenses/by-nc-sa/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-09-03T09:52:29Zoai:ri.conicet.gov.ar:11336/220161instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-09-03 09:52:29.326CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
title Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
spellingShingle Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
Azpeitia, Leticia Anahi
COPPER ELECTRODES
DEEP EUTECTIC SOLVENTS
ELECTROCHEMICAL BEHAVIOUR
FILM GROWTH
TIN ELECTRODEPOSITION
title_short Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
title_full Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
title_fullStr Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
title_full_unstemmed Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
title_sort Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents
dc.creator.none.fl_str_mv Azpeitia, Leticia Anahi
Gervasi, Claudio
Bolzán, Agustín Eduardo
author Azpeitia, Leticia Anahi
author_facet Azpeitia, Leticia Anahi
Gervasi, Claudio
Bolzán, Agustín Eduardo
author_role author
author2 Gervasi, Claudio
Bolzán, Agustín Eduardo
author2_role author
author
dc.subject.none.fl_str_mv COPPER ELECTRODES
DEEP EUTECTIC SOLVENTS
ELECTROCHEMICAL BEHAVIOUR
FILM GROWTH
TIN ELECTRODEPOSITION
topic COPPER ELECTRODES
DEEP EUTECTIC SOLVENTS
ELECTROCHEMICAL BEHAVIOUR
FILM GROWTH
TIN ELECTRODEPOSITION
purl_subject.fl_str_mv https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
dc.description.none.fl_txt_mv The electrodeposition process of tin films on copper electrodes in ethaline and reline deep eutectic solvents (DES) was studied in the 303 – 353 K range. Voltammetric data indicate the presence of underpotential and overpotential electrodeposition processes. While the former occurs under surface-reaction control, the latter proceeds under mass transport control. Electrochemical impedance spectroscopy shows two capacitive contributions during the underpotential process and a single capacitive contribution at high frequencies and a Warburg contribution at low frequencies, when the electrodeposition process takes place in the overpotential region. Tin deposits obtained in ethaline exhibit blunt particles with ordered structures whereas in reline facetted particles with no preferential order are observed as electrodeposition time is increased. The electrocrystallization mechanism under overpotential conditions in ethaline and reline corresponds to an instantaneous nucleation and a 3D growth process. For underpotential conditions in ethaline, an instantaneous nucleation and 2D growth coupled to an adsorption process occurs. XRD spectra shows the formation of Cu3Sn and Cu6Sn5 intermetallics due to the diffusion of Sn atoms into the Cu lattice during the electrodeposition process. From rotating disk electrode measurements, the diffusion coefficient of Sn(II) ions in both DES at different temperatures, and the diffusion activation energy, were determined.
Fil: Azpeitia, Leticia Anahi. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; Argentina
Fil: Gervasi, Claudio. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; Argentina
Fil: Bolzán, Agustín Eduardo. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; Argentina
description The electrodeposition process of tin films on copper electrodes in ethaline and reline deep eutectic solvents (DES) was studied in the 303 – 353 K range. Voltammetric data indicate the presence of underpotential and overpotential electrodeposition processes. While the former occurs under surface-reaction control, the latter proceeds under mass transport control. Electrochemical impedance spectroscopy shows two capacitive contributions during the underpotential process and a single capacitive contribution at high frequencies and a Warburg contribution at low frequencies, when the electrodeposition process takes place in the overpotential region. Tin deposits obtained in ethaline exhibit blunt particles with ordered structures whereas in reline facetted particles with no preferential order are observed as electrodeposition time is increased. The electrocrystallization mechanism under overpotential conditions in ethaline and reline corresponds to an instantaneous nucleation and a 3D growth process. For underpotential conditions in ethaline, an instantaneous nucleation and 2D growth coupled to an adsorption process occurs. XRD spectra shows the formation of Cu3Sn and Cu6Sn5 intermetallics due to the diffusion of Sn atoms into the Cu lattice during the electrodeposition process. From rotating disk electrode measurements, the diffusion coefficient of Sn(II) ions in both DES at different temperatures, and the diffusion activation energy, were determined.
publishDate 2023
dc.date.none.fl_str_mv 2023-09
info:eu-repo/date/embargoEnd/2024-03-13
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/220161
Azpeitia, Leticia Anahi; Gervasi, Claudio; Bolzán, Agustín Eduardo; Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents; Elsevier Science SA; Journal of Electroanalytical Chemistry; 944; 9-2023; 1-34
1572-6657
CONICET Digital
CONICET
url http://hdl.handle.net/11336/220161
identifier_str_mv Azpeitia, Leticia Anahi; Gervasi, Claudio; Bolzán, Agustín Eduardo; Electrochemical formation of Sn films on copper by overpotential and underpotential electrodeposition in deep eutectic solvents; Elsevier Science SA; Journal of Electroanalytical Chemistry; 944; 9-2023; 1-34
1572-6657
CONICET Digital
CONICET
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/url/https://linkinghub.elsevier.com/retrieve/pii/S1572665723004976
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.jelechem.2023.117637
dc.rights.none.fl_str_mv info:eu-repo/semantics/embargoedAccess
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
eu_rights_str_mv embargoedAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
application/pdf
application/pdf
dc.publisher.none.fl_str_mv Elsevier Science SA
publisher.none.fl_str_mv Elsevier Science SA
dc.source.none.fl_str_mv reponame:CONICET Digital (CONICET)
instname:Consejo Nacional de Investigaciones Científicas y Técnicas
reponame_str CONICET Digital (CONICET)
collection CONICET Digital (CONICET)
instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
_version_ 1842269161629155328
score 13.13397

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