Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives

Autores
Vázquez, L.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
1997
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are consistent with the predictions of the complete linear equation for interface growth. In agreement with the theory, experimental data show, for the interface evolution, a crossover from a surface diffusion controlled regime to an Edwards-Wilkinson regime as the length scale increases.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Facultad de Ciencias Exactas
Materia
Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by-nc-sa/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/86332
Acceder
id SEDICI_ee88b3e1f5a446d3e03fb4a997e16652
oai_identifier_str oai:sedici.unlp.edu.ar:10915/86332
network_acronym_str SEDICI
repository_id_str 1329
network_name_str SEDICI (UNLP)
spelling Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additivesVázquez, L.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaCobreelectrodepositionTioureaMicroscopía de Fuerza AtómicaModelo de crecimientoFractalesThe interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are consistent with the predictions of the complete linear equation for interface growth. In agreement with the theory, experimental data show, for the interface evolution, a crossover from a surface diffusion controlled regime to an Edwards-Wilkinson regime as the length scale increases.Instituto de Investigaciones Fisicoquímicas Teóricas y AplicadasFacultad de Ciencias Exactas1997-07-28info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf709-712http://sedici.unlp.edu.ar/handle/10915/86332enginfo:eu-repo/semantics/altIdentifier/issn/0031-9007info:eu-repo/semantics/altIdentifier/doi/10.1103/PhysRevLett.79.709info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-10-15T11:09:01Zoai:sedici.unlp.edu.ar:10915/86332Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-10-15 11:09:02.015SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
spellingShingle Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
Vázquez, L.
Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
title_short Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_full Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_fullStr Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_full_unstemmed Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_sort Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
dc.creator.none.fl_str_mv Vázquez, L.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Vázquez, L.
author_facet Vázquez, L.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
topic Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
dc.description.none.fl_txt_mv The interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are consistent with the predictions of the complete linear equation for interface growth. In agreement with the theory, experimental data show, for the interface evolution, a crossover from a surface diffusion controlled regime to an Edwards-Wilkinson regime as the length scale increases.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Facultad de Ciencias Exactas
description The interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are consistent with the predictions of the complete linear equation for interface growth. In agreement with the theory, experimental data show, for the interface evolution, a crossover from a surface diffusion controlled regime to an Edwards-Wilkinson regime as the length scale increases.
publishDate 1997
dc.date.none.fl_str_mv 1997-07-28
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/86332
url http://sedici.unlp.edu.ar/handle/10915/86332
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/0031-9007
info:eu-repo/semantics/altIdentifier/doi/10.1103/PhysRevLett.79.709
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
dc.format.none.fl_str_mv application/pdf
709-712
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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score 12.891075

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