Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering

Autores
Benegra, M.; Lamas, Diego German; Fernández de Rapp, M. E.; Mingolo, N.; Kunrath, A. O.; Souza, R. M.
Año de publicación
2006
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
This work presents a study on the effect of deposition parameters on the residual stresses developed in titanium nitride (TiN) thin films deposited onto cemented carbide (WC-Co) substrates. Depositions were conducted by reactive unbalanced magnetron sputtering of a single titanium target. Six different conditions were selected, varying parameters such as bias (0, − 50 or − 100 V), power applied to the target (direct current or pulsed direct current) and, in the cases where substrate bias was zero, substrate condition (ground or floating). Pulsed power was applied at a frequency of 50 kHz and with a reverse pulse time of 1 μs. Residual stresses were evaluated through X-ray diffraction, using the sin2ψ method. Results confirmed the effect of substrate bias on the residual stresses of thin films. Additionally, it was possible to observe that by pulsing the power to the target, residual stress varies as a consequence of the increased ion energy.
Fil: Benegra, M.. Universidade de Sao Paulo; Brasil
Fil: Lamas, Diego German. Consejo Nacional de Investigaciones Científicas y Técnicas. Instituto de Investigaciones Científicas y Técnicas de las Fuerzas Armadas. Centro de Investigaciones en Sólidos; Argentina
Fil: Fernández de Rapp, M. E.. Consejo Nacional de Investigaciones Científicas y Técnicas. Instituto de Investigaciones Científicas y Técnicas de las Fuerzas Armadas. Centro de Investigaciones en Sólidos; Argentina
Fil: Mingolo, N.. Comisión Nacional de Energía Atómica; Argentina
Fil: Kunrath, A. O.. Colorado School of Mines; Estados Unidos
Fil: Souza, R. M.. Universidade de Sao Paulo; Brasil
Materia
Stress
Plasma processing and deposition
Titanium nitride
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/279336
Acceder
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oai_identifier_str oai:ri.conicet.gov.ar:11336/279336
network_acronym_str CONICETDig
repository_id_str 3498
network_name_str CONICET Digital (CONICET)
spelling Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputteringBenegra, M.Lamas, Diego GermanFernández de Rapp, M. E.Mingolo, N.Kunrath, A. O.Souza, R. M.StressPlasma processing and depositionTitanium nitridehttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2This work presents a study on the effect of deposition parameters on the residual stresses developed in titanium nitride (TiN) thin films deposited onto cemented carbide (WC-Co) substrates. Depositions were conducted by reactive unbalanced magnetron sputtering of a single titanium target. Six different conditions were selected, varying parameters such as bias (0, − 50 or − 100 V), power applied to the target (direct current or pulsed direct current) and, in the cases where substrate bias was zero, substrate condition (ground or floating). Pulsed power was applied at a frequency of 50 kHz and with a reverse pulse time of 1 μs. Residual stresses were evaluated through X-ray diffraction, using the sin2ψ method. Results confirmed the effect of substrate bias on the residual stresses of thin films. Additionally, it was possible to observe that by pulsing the power to the target, residual stress varies as a consequence of the increased ion energy.Fil: Benegra, M.. Universidade de Sao Paulo; BrasilFil: Lamas, Diego German. Consejo Nacional de Investigaciones Científicas y Técnicas. Instituto de Investigaciones Científicas y Técnicas de las Fuerzas Armadas. Centro de Investigaciones en Sólidos; ArgentinaFil: Fernández de Rapp, M. E.. Consejo Nacional de Investigaciones Científicas y Técnicas. Instituto de Investigaciones Científicas y Técnicas de las Fuerzas Armadas. Centro de Investigaciones en Sólidos; ArgentinaFil: Mingolo, N.. Comisión Nacional de Energía Atómica; ArgentinaFil: Kunrath, A. O.. Colorado School of Mines; Estados UnidosFil: Souza, R. M.. Universidade de Sao Paulo; BrasilElsevier Science SA2006-01info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/279336Benegra, M.; Lamas, Diego German; Fernández de Rapp, M. E.; Mingolo, N.; Kunrath, A. O.; et al.; Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering; Elsevier Science SA; Thin Solid Films; 494; 1-2; 1-2006; 146-1500040-6090CONICET DigitalCONICETenginfo:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/abs/pii/S0040609005014562info:eu-repo/semantics/altIdentifier/doi/10.1016/j.tsf.2005.08.214info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by-nc-sa/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2026-02-26T09:59:22Zoai:ri.conicet.gov.ar:11336/279336instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982026-02-26 09:59:22.677CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
title Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
spellingShingle Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
Benegra, M.
Stress
Plasma processing and deposition
Titanium nitride
title_short Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
title_full Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
title_fullStr Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
title_full_unstemmed Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
title_sort Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
dc.creator.none.fl_str_mv Benegra, M.
Lamas, Diego German
Fernández de Rapp, M. E.
Mingolo, N.
Kunrath, A. O.
Souza, R. M.
author Benegra, M.
author_facet Benegra, M.
Lamas, Diego German
Fernández de Rapp, M. E.
Mingolo, N.
Kunrath, A. O.
Souza, R. M.
author_role author
author2 Lamas, Diego German
Fernández de Rapp, M. E.
Mingolo, N.
Kunrath, A. O.
Souza, R. M.
author2_role author
author
author
author
author
dc.subject.none.fl_str_mv Stress
Plasma processing and deposition
Titanium nitride
topic Stress
Plasma processing and deposition
Titanium nitride
purl_subject.fl_str_mv https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
dc.description.none.fl_txt_mv This work presents a study on the effect of deposition parameters on the residual stresses developed in titanium nitride (TiN) thin films deposited onto cemented carbide (WC-Co) substrates. Depositions were conducted by reactive unbalanced magnetron sputtering of a single titanium target. Six different conditions were selected, varying parameters such as bias (0, − 50 or − 100 V), power applied to the target (direct current or pulsed direct current) and, in the cases where substrate bias was zero, substrate condition (ground or floating). Pulsed power was applied at a frequency of 50 kHz and with a reverse pulse time of 1 μs. Residual stresses were evaluated through X-ray diffraction, using the sin2ψ method. Results confirmed the effect of substrate bias on the residual stresses of thin films. Additionally, it was possible to observe that by pulsing the power to the target, residual stress varies as a consequence of the increased ion energy.
Fil: Benegra, M.. Universidade de Sao Paulo; Brasil
Fil: Lamas, Diego German. Consejo Nacional de Investigaciones Científicas y Técnicas. Instituto de Investigaciones Científicas y Técnicas de las Fuerzas Armadas. Centro de Investigaciones en Sólidos; Argentina
Fil: Fernández de Rapp, M. E.. Consejo Nacional de Investigaciones Científicas y Técnicas. Instituto de Investigaciones Científicas y Técnicas de las Fuerzas Armadas. Centro de Investigaciones en Sólidos; Argentina
Fil: Mingolo, N.. Comisión Nacional de Energía Atómica; Argentina
Fil: Kunrath, A. O.. Colorado School of Mines; Estados Unidos
Fil: Souza, R. M.. Universidade de Sao Paulo; Brasil
description This work presents a study on the effect of deposition parameters on the residual stresses developed in titanium nitride (TiN) thin films deposited onto cemented carbide (WC-Co) substrates. Depositions were conducted by reactive unbalanced magnetron sputtering of a single titanium target. Six different conditions were selected, varying parameters such as bias (0, − 50 or − 100 V), power applied to the target (direct current or pulsed direct current) and, in the cases where substrate bias was zero, substrate condition (ground or floating). Pulsed power was applied at a frequency of 50 kHz and with a reverse pulse time of 1 μs. Residual stresses were evaluated through X-ray diffraction, using the sin2ψ method. Results confirmed the effect of substrate bias on the residual stresses of thin films. Additionally, it was possible to observe that by pulsing the power to the target, residual stress varies as a consequence of the increased ion energy.
publishDate 2006
dc.date.none.fl_str_mv 2006-01
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/279336
Benegra, M.; Lamas, Diego German; Fernández de Rapp, M. E.; Mingolo, N.; Kunrath, A. O.; et al.; Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering; Elsevier Science SA; Thin Solid Films; 494; 1-2; 1-2006; 146-150
0040-6090
CONICET Digital
CONICET
url http://hdl.handle.net/11336/279336
identifier_str_mv Benegra, M.; Lamas, Diego German; Fernández de Rapp, M. E.; Mingolo, N.; Kunrath, A. O.; et al.; Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering; Elsevier Science SA; Thin Solid Films; 494; 1-2; 1-2006; 146-150
0040-6090
CONICET Digital
CONICET
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/abs/pii/S0040609005014562
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.tsf.2005.08.214
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv Elsevier Science SA
publisher.none.fl_str_mv Elsevier Science SA
dc.source.none.fl_str_mv reponame:CONICET Digital (CONICET)
instname:Consejo Nacional de Investigaciones Científicas y Técnicas
reponame_str CONICET Digital (CONICET)
collection CONICET Digital (CONICET)
instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
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score 13.176822

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