Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits

Autores
Molinari, Fabricio Nicolás; Bilbao, Emanuel; Monsalve, Leandro Nicolas
Año de publicación
2025
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Placing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3D-printed pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.
Fil: Molinari, Fabricio Nicolás. Consiglio Nazionale delle Ricerche; Italia
Fil: Bilbao, Emanuel. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Instituto Nacional de Tecnología Industrial; Argentina
Fil: Monsalve, Leandro Nicolas. Instituto Nacional de Tecnología Industrial; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Universidad Nacional de San Martín. Instituto de Calidad Industrial. - Instituto Nacional de Tecnología Industrial. Instituto de Calidad Industrial; Argentina
Materia
PRINTED ELECTRONICS
3D PRINTING
PRINTED TRANSFERS
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/267944
Acceder
id CONICETDig_976ca4234a3ea1d8820b0fe0ed90d1db
oai_identifier_str oai:ri.conicet.gov.ar:11336/267944
network_acronym_str CONICETDig
repository_id_str 3498
network_name_str CONICET Digital (CONICET)
spelling Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar CircuitsMolinari, Fabricio NicolásBilbao, EmanuelMonsalve, Leandro NicolasPRINTED ELECTRONICS3D PRINTINGPRINTED TRANSFERShttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2Placing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3D-printed pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.Fil: Molinari, Fabricio Nicolás. Consiglio Nazionale delle Ricerche; ItaliaFil: Bilbao, Emanuel. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Instituto Nacional de Tecnología Industrial; ArgentinaFil: Monsalve, Leandro Nicolas. Instituto Nacional de Tecnología Industrial; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Universidad Nacional de San Martín. Instituto de Calidad Industrial. - Instituto Nacional de Tecnología Industrial. Instituto de Calidad Industrial; ArgentinaMDPI2025-06info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/267944Molinari, Fabricio Nicolás; Bilbao, Emanuel; Monsalve, Leandro Nicolas; Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits; MDPI; Applied Nano; 6; 2; 6-2025; 1-202673-3501CONICET DigitalCONICETenginfo:eu-repo/semantics/altIdentifier/url/https://www.mdpi.com/2673-3501/6/2/10info:eu-repo/semantics/altIdentifier/doi/10.3390/applnano6020010info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-09-29T10:01:52Zoai:ri.conicet.gov.ar:11336/267944instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-09-29 10:01:52.948CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
spellingShingle Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
Molinari, Fabricio Nicolás
PRINTED ELECTRONICS
3D PRINTING
PRINTED TRANSFERS
title_short Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_full Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_fullStr Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_full_unstemmed Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_sort Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
dc.creator.none.fl_str_mv Molinari, Fabricio Nicolás
Bilbao, Emanuel
Monsalve, Leandro Nicolas
author Molinari, Fabricio Nicolás
author_facet Molinari, Fabricio Nicolás
Bilbao, Emanuel
Monsalve, Leandro Nicolas
author_role author
author2 Bilbao, Emanuel
Monsalve, Leandro Nicolas
author2_role author
author
dc.subject.none.fl_str_mv PRINTED ELECTRONICS
3D PRINTING
PRINTED TRANSFERS
topic PRINTED ELECTRONICS
3D PRINTING
PRINTED TRANSFERS
purl_subject.fl_str_mv https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
dc.description.none.fl_txt_mv Placing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3D-printed pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.
Fil: Molinari, Fabricio Nicolás. Consiglio Nazionale delle Ricerche; Italia
Fil: Bilbao, Emanuel. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Instituto Nacional de Tecnología Industrial; Argentina
Fil: Monsalve, Leandro Nicolas. Instituto Nacional de Tecnología Industrial; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Universidad Nacional de San Martín. Instituto de Calidad Industrial. - Instituto Nacional de Tecnología Industrial. Instituto de Calidad Industrial; Argentina
description Placing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3D-printed pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.
publishDate 2025
dc.date.none.fl_str_mv 2025-06
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/267944
Molinari, Fabricio Nicolás; Bilbao, Emanuel; Monsalve, Leandro Nicolas; Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits; MDPI; Applied Nano; 6; 2; 6-2025; 1-20
2673-3501
CONICET Digital
CONICET
url http://hdl.handle.net/11336/267944
identifier_str_mv Molinari, Fabricio Nicolás; Bilbao, Emanuel; Monsalve, Leandro Nicolas; Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits; MDPI; Applied Nano; 6; 2; 6-2025; 1-20
2673-3501
CONICET Digital
CONICET
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/url/https://www.mdpi.com/2673-3501/6/2/10
info:eu-repo/semantics/altIdentifier/doi/10.3390/applnano6020010
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
https://creativecommons.org/licenses/by/2.5/ar/
eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv MDPI
publisher.none.fl_str_mv MDPI
dc.source.none.fl_str_mv reponame:CONICET Digital (CONICET)
instname:Consejo Nacional de Investigaciones Científicas y Técnicas
reponame_str CONICET Digital (CONICET)
collection CONICET Digital (CONICET)
instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
_version_ 1844613817253756928
score 13.070432

Publicaciones similares