Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits

Autores
Molinari, F. N.; Bilbao, E.; Monsalve, L. N.
Año de publicación
2025
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Placing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3Dprinted pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.
Fil: Molinari, F. N. Instituto Nacional de Tecnolog a Industrial. Textiles (INTI-Textiles); Argentina
Fil: Molinari, F. N. University of Messina. Department of Chemical, Biological, Pharmaceutical and Environmental Sciences (UNIME); Italia
Fil: Bilbao, E. Instituto Nacional de Tecnolog a Industrial. Micro y Nanotecnolog as (INTI); Argentina
Fil: Monsalve, L. N. Instituto Nacional de Tecnolog a Industrial. Textiles (INTI-Textiles); Argentina
Fil: Monsalve, L. N. Universidad Nacional de San Mart n. Instituto de la Calidad Industrial (UNSAM-INCALIN); Argentina
Fil: Monsalve, L. N. Consejo Nacional de Investigaciones Cient ficas y T cnicas (CONICET); Argentina
Fuente
Applied Nano, 6 (2025)
Materia
Conductores el ctricos
Tinta
Inyecci n
Circuitos
Circuitos electr nicos
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by/4.0/
Repositorio
Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI)
Institución
Instituto Nacional de Tecnología Industrial
OAI Identificador
nuevadc:2025MolinariF1_pdf
Acceder
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repository_id_str
network_name_str Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI)
spelling Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar CircuitsMolinari, F. N.Bilbao, E.Monsalve, L. N.Conductores el ctricosTintaInyecci nCircuitosCircuitos electr nicosPlacing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3Dprinted pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.Fil: Molinari, F. N. Instituto Nacional de Tecnolog a Industrial. Textiles (INTI-Textiles); ArgentinaFil: Molinari, F. N. University of Messina. Department of Chemical, Biological, Pharmaceutical and Environmental Sciences (UNIME); ItaliaFil: Bilbao, E. Instituto Nacional de Tecnolog a Industrial. Micro y Nanotecnolog as (INTI); ArgentinaFil: Monsalve, L. N. Instituto Nacional de Tecnolog a Industrial. Textiles (INTI-Textiles); ArgentinaFil: Monsalve, L. N. Universidad Nacional de San Mart n. Instituto de la Calidad Industrial (UNSAM-INCALIN); ArgentinaFil: Monsalve, L. N. Consejo Nacional de Investigaciones Cient ficas y T cnicas (CONICET); ArgentinaMDPI2025info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf2025MolinariF1.pdfhttps://app.inti.gob.ar/greenstone3/sites/localsite/collect/nuevadc/index/assoc/2025Moli/nariF1_p.dir/doc.pdfApplied Nano, 6 (2025)reponame:Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI)instname:Instituto Nacional de Tecnología Industrialenginfo:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by/4.0/openAccess2025-10-23T11:20:22Znuevadc:2025MolinariF1_pdfinstacron:INTIInstitucionalhttps://app.inti.gob.ar/greenstone3/biblioOrganismo científico-tecnológicohttps://argentina.gob.ar/intihttps://app.inti.gob.ar/greenstone3/oaiserver?verb=Identifypfalcato@inti.gob.arArgentinaopendoar:2025-10-23 11:20:23.001Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI) - Instituto Nacional de Tecnología Industrialfalse
dc.title.none.fl_str_mv Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
spellingShingle Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
Molinari, F. N.
Conductores el ctricos
Tinta
Inyecci n
Circuitos
Circuitos electr nicos
title_short Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_full Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_fullStr Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_full_unstemmed Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
title_sort Inkjet-Printed Conductive Patterns on Electrospun Substrates for the Modular Fabrication of Nonplanar Circuits
dc.creator.none.fl_str_mv Molinari, F. N.
Bilbao, E.
Monsalve, L. N.
author Molinari, F. N.
author_facet Molinari, F. N.
Bilbao, E.
Monsalve, L. N.
author_role author
author2 Bilbao, E.
Monsalve, L. N.
author2_role author
author
dc.subject.none.fl_str_mv Conductores el ctricos
Tinta
Inyecci n
Circuitos
Circuitos electr nicos
topic Conductores el ctricos
Tinta
Inyecci n
Circuitos
Circuitos electr nicos
dc.description.none.fl_txt_mv Placing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3Dprinted pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.
Fil: Molinari, F. N. Instituto Nacional de Tecnolog a Industrial. Textiles (INTI-Textiles); Argentina
Fil: Molinari, F. N. University of Messina. Department of Chemical, Biological, Pharmaceutical and Environmental Sciences (UNIME); Italia
Fil: Bilbao, E. Instituto Nacional de Tecnolog a Industrial. Micro y Nanotecnolog as (INTI); Argentina
Fil: Monsalve, L. N. Instituto Nacional de Tecnolog a Industrial. Textiles (INTI-Textiles); Argentina
Fil: Monsalve, L. N. Universidad Nacional de San Mart n. Instituto de la Calidad Industrial (UNSAM-INCALIN); Argentina
Fil: Monsalve, L. N. Consejo Nacional de Investigaciones Cient ficas y T cnicas (CONICET); Argentina
description Placing printed conductive patterns onto nonplanar substrates is a challenging task. In this work, we tested a simple method for depositing inkjet-printed conductive patterns onto 3D-printed pieces with cavities and sharp edges. First, a silver nanoparticle ink was used to print conductive patterns onto a flexible and porous substrate made of electrospun polycaprolactone (PCL). Then, the printed patterns were transferred to 3Dprinted pieces made of polylactic acid (PLA) by temperature-promoted adhesion. Finally, the printed patterns were cured to render them conductive. The influence of the number of printed layers on their electrical and mechanical properties was evaluated. The printed patterns were also transferred to flexible substrates, such as thermoplastic polyurethane (TPU) and polyethylene terephthalate (PET) sheets, achieving conductivity after curing. Moreover, the printed patterns were effective for modular interconnection among successive transferred patterns, since it was possible to achieve electrical contact between them during the transfer process.
publishDate 2025
dc.date.none.fl_str_mv 2025
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv 2025MolinariF1.pdf
https://app.inti.gob.ar/greenstone3/sites/localsite/collect/nuevadc/index/assoc/2025Moli/nariF1_p.dir/doc.pdf
identifier_str_mv 2025MolinariF1.pdf
url https://app.inti.gob.ar/greenstone3/sites/localsite/collect/nuevadc/index/assoc/2025Moli/nariF1_p.dir/doc.pdf
dc.language.none.fl_str_mv eng
language eng
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
https://creativecommons.org/licenses/by/4.0/
openAccess
eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by/4.0/
openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv MDPI
publisher.none.fl_str_mv MDPI
dc.source.none.fl_str_mv Applied Nano, 6 (2025)
reponame:Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI)
instname:Instituto Nacional de Tecnología Industrial
reponame_str Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI)
collection Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI)
instname_str Instituto Nacional de Tecnología Industrial
repository.name.fl_str_mv Repositorio Institucional del Instituto Nacional de Tecnología Industrial (INTI) - Instituto Nacional de Tecnología Industrial
repository.mail.fl_str_mv pfalcato@inti.gob.ar
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score 12.471625

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