Thermal properties of Sn-based solder alloys

Autores
Morando, Carina Noemi; Fornaro, Osvaldo; Garbellini, Olga; Palacio, Hugo Anibal
Año de publicación
2014
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
During last few decades, emerging environmental regulations worldwide, more notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherent toxicity of this element.This situation drives to the replacement of the SnPb solder alloy of eutectic composition commonly used as joining material to suitable lead-free solders for microelectronic assembly. Sn-based alloys containing Ag, Cu, Bi, and Zn are potential lead-free solders, usually close to the binary or ternary eutectic composition. For this reason a great effort was directed to establish reliable thermophysical data fundamental to interpret the solidification process and fluidity of alloys belonging to these systems. In this work, an analysis of the solidification process of pure Sn, binary SnAg, SnCu, SnBi, SnZn, SnPb and ternary SnAgCu eutectic alloys was carried out using computer aided-cooling curve analysis and differential scanning calorimetry.
Fil: Morando, Carina Noemi. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
Fil: Fornaro, Osvaldo. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
Fil: Garbellini, Olga. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
Fil: Palacio, Hugo Anibal. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
Materia
Sn-Based Alloys
Lead-Free Solders
Differential Scanning Calorimetry
Computer Aided-Cooling Curve Analysis
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/4596
Acceder
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network_name_str CONICET Digital (CONICET)
spelling Thermal properties of Sn-based solder alloysMorando, Carina NoemiFornaro, OsvaldoGarbellini, OlgaPalacio, Hugo AnibalSn-Based AlloysLead-Free SoldersDifferential Scanning CalorimetryComputer Aided-Cooling Curve Analysishttps://purl.org/becyt/ford/1.3https://purl.org/becyt/ford/1During last few decades, emerging environmental regulations worldwide, more notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherent toxicity of this element.This situation drives to the replacement of the SnPb solder alloy of eutectic composition commonly used as joining material to suitable lead-free solders for microelectronic assembly. Sn-based alloys containing Ag, Cu, Bi, and Zn are potential lead-free solders, usually close to the binary or ternary eutectic composition. For this reason a great effort was directed to establish reliable thermophysical data fundamental to interpret the solidification process and fluidity of alloys belonging to these systems. In this work, an analysis of the solidification process of pure Sn, binary SnAg, SnCu, SnBi, SnZn, SnPb and ternary SnAgCu eutectic alloys was carried out using computer aided-cooling curve analysis and differential scanning calorimetry.Fil: Morando, Carina Noemi. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; ArgentinaFil: Fornaro, Osvaldo. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; ArgentinaFil: Garbellini, Olga. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; ArgentinaFil: Palacio, Hugo Anibal. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; ArgentinaSpringer2014-06info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/4596Morando, Carina Noemi; Fornaro, Osvaldo; Garbellini, Olga; Palacio, Hugo Anibal; Thermal properties of Sn-based solder alloys; Springer; Journal of Materials Science: Materials in Electronics; 25; 8; 6-2014; 3440-34470957-4522enginfo:eu-repo/semantics/altIdentifier/doi/10.1007/s10854-014-2036-6info:eu-repo/semantics/altIdentifier/issn/0957-4522info:eu-repo/semantics/altIdentifier/url/http://link.springer.com/article/10.1007%2Fs10854-014-2036-6info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by-nc-sa/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-10-22T11:01:19Zoai:ri.conicet.gov.ar:11336/4596instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-10-22 11:01:19.648CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Thermal properties of Sn-based solder alloys
title Thermal properties of Sn-based solder alloys
spellingShingle Thermal properties of Sn-based solder alloys
Morando, Carina Noemi
Sn-Based Alloys
Lead-Free Solders
Differential Scanning Calorimetry
Computer Aided-Cooling Curve Analysis
title_short Thermal properties of Sn-based solder alloys
title_full Thermal properties of Sn-based solder alloys
title_fullStr Thermal properties of Sn-based solder alloys
title_full_unstemmed Thermal properties of Sn-based solder alloys
title_sort Thermal properties of Sn-based solder alloys
dc.creator.none.fl_str_mv Morando, Carina Noemi
Fornaro, Osvaldo
Garbellini, Olga
Palacio, Hugo Anibal
author Morando, Carina Noemi
author_facet Morando, Carina Noemi
Fornaro, Osvaldo
Garbellini, Olga
Palacio, Hugo Anibal
author_role author
author2 Fornaro, Osvaldo
Garbellini, Olga
Palacio, Hugo Anibal
author2_role author
author
author
dc.subject.none.fl_str_mv Sn-Based Alloys
Lead-Free Solders
Differential Scanning Calorimetry
Computer Aided-Cooling Curve Analysis
topic Sn-Based Alloys
Lead-Free Solders
Differential Scanning Calorimetry
Computer Aided-Cooling Curve Analysis
purl_subject.fl_str_mv https://purl.org/becyt/ford/1.3
https://purl.org/becyt/ford/1
dc.description.none.fl_txt_mv During last few decades, emerging environmental regulations worldwide, more notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherent toxicity of this element.This situation drives to the replacement of the SnPb solder alloy of eutectic composition commonly used as joining material to suitable lead-free solders for microelectronic assembly. Sn-based alloys containing Ag, Cu, Bi, and Zn are potential lead-free solders, usually close to the binary or ternary eutectic composition. For this reason a great effort was directed to establish reliable thermophysical data fundamental to interpret the solidification process and fluidity of alloys belonging to these systems. In this work, an analysis of the solidification process of pure Sn, binary SnAg, SnCu, SnBi, SnZn, SnPb and ternary SnAgCu eutectic alloys was carried out using computer aided-cooling curve analysis and differential scanning calorimetry.
Fil: Morando, Carina Noemi. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
Fil: Fornaro, Osvaldo. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
Fil: Garbellini, Olga. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
Fil: Palacio, Hugo Anibal. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina
description During last few decades, emerging environmental regulations worldwide, more notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherent toxicity of this element.This situation drives to the replacement of the SnPb solder alloy of eutectic composition commonly used as joining material to suitable lead-free solders for microelectronic assembly. Sn-based alloys containing Ag, Cu, Bi, and Zn are potential lead-free solders, usually close to the binary or ternary eutectic composition. For this reason a great effort was directed to establish reliable thermophysical data fundamental to interpret the solidification process and fluidity of alloys belonging to these systems. In this work, an analysis of the solidification process of pure Sn, binary SnAg, SnCu, SnBi, SnZn, SnPb and ternary SnAgCu eutectic alloys was carried out using computer aided-cooling curve analysis and differential scanning calorimetry.
publishDate 2014
dc.date.none.fl_str_mv 2014-06
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/4596
Morando, Carina Noemi; Fornaro, Osvaldo; Garbellini, Olga; Palacio, Hugo Anibal; Thermal properties of Sn-based solder alloys; Springer; Journal of Materials Science: Materials in Electronics; 25; 8; 6-2014; 3440-3447
0957-4522
url http://hdl.handle.net/11336/4596
identifier_str_mv Morando, Carina Noemi; Fornaro, Osvaldo; Garbellini, Olga; Palacio, Hugo Anibal; Thermal properties of Sn-based solder alloys; Springer; Journal of Materials Science: Materials in Electronics; 25; 8; 6-2014; 3440-3447
0957-4522
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/doi/10.1007/s10854-014-2036-6
info:eu-repo/semantics/altIdentifier/issn/0957-4522
info:eu-repo/semantics/altIdentifier/url/http://link.springer.com/article/10.1007%2Fs10854-014-2036-6
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
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eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv Springer
publisher.none.fl_str_mv Springer
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reponame_str CONICET Digital (CONICET)
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instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
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score 12.982451

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