New thermal and rheological approaches of chickpea–wheat dough for breadmaking
- Autores
- Bigne, Facundo; Romero, Alberto; Ferrero, Cristina; Puppo, María Cecilia; Guerrero, Antonio
- Año de publicación
- 2021
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques.
Centro de Investigación y Desarrollo en Criotecnología de Alimentos - Materia
-
Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by-nc-sa/4.0/
- Repositorio
- Institución
- Universidad Nacional de La Plata
- OAI Identificador
- oai:sedici.unlp.edu.ar:10915/146371
Ver los metadatos del registro completo
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New thermal and rheological approaches of chickpea–wheat dough for breadmakingBigne, FacundoRomero, AlbertoFerrero, CristinaPuppo, María CeciliaGuerrero, AntonioQuímicaWheatChickpeaRheologyMicrostructureThermal propertiesChickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques.Centro de Investigación y Desarrollo en Criotecnología de Alimentos2021-02-10info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf1107-1115http://sedici.unlp.edu.ar/handle/10915/146371enginfo:eu-repo/semantics/altIdentifier/issn/1438-2377info:eu-repo/semantics/altIdentifier/issn/1438-2385info:eu-repo/semantics/altIdentifier/doi/10.1007/s00217-021-03691-4info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:32:32Zoai:sedici.unlp.edu.ar:10915/146371Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:32:33.081SEDICI (UNLP) - Universidad Nacional de La Platafalse |
dc.title.none.fl_str_mv |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking |
title |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking |
spellingShingle |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking Bigne, Facundo Química Wheat Chickpea Rheology Microstructure Thermal properties |
title_short |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking |
title_full |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking |
title_fullStr |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking |
title_full_unstemmed |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking |
title_sort |
New thermal and rheological approaches of chickpea–wheat dough for breadmaking |
dc.creator.none.fl_str_mv |
Bigne, Facundo Romero, Alberto Ferrero, Cristina Puppo, María Cecilia Guerrero, Antonio |
author |
Bigne, Facundo |
author_facet |
Bigne, Facundo Romero, Alberto Ferrero, Cristina Puppo, María Cecilia Guerrero, Antonio |
author_role |
author |
author2 |
Romero, Alberto Ferrero, Cristina Puppo, María Cecilia Guerrero, Antonio |
author2_role |
author author author author |
dc.subject.none.fl_str_mv |
Química Wheat Chickpea Rheology Microstructure Thermal properties |
topic |
Química Wheat Chickpea Rheology Microstructure Thermal properties |
dc.description.none.fl_txt_mv |
Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques. Centro de Investigación y Desarrollo en Criotecnología de Alimentos |
description |
Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques. |
publishDate |
2021 |
dc.date.none.fl_str_mv |
2021-02-10 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion Articulo http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://sedici.unlp.edu.ar/handle/10915/146371 |
url |
http://sedici.unlp.edu.ar/handle/10915/146371 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/issn/1438-2377 info:eu-repo/semantics/altIdentifier/issn/1438-2385 info:eu-repo/semantics/altIdentifier/doi/10.1007/s00217-021-03691-4 |
dc.rights.none.fl_str_mv |
info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by-nc-sa/4.0/ Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) |
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openAccess |
rights_invalid_str_mv |
http://creativecommons.org/licenses/by-nc-sa/4.0/ Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) |
dc.format.none.fl_str_mv |
application/pdf 1107-1115 |
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SEDICI (UNLP) - Universidad Nacional de La Plata |
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