New thermal and rheological approaches of chickpea–wheat dough for breadmaking

Autores
Bigne, Facundo; Romero, Alberto; Ferrero, Cristina; Puppo, María Cecilia; Guerrero, Antonio
Año de publicación
2021
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques.
Centro de Investigación y Desarrollo en Criotecnología de Alimentos
Materia
Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by-nc-sa/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/146371

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network_name_str SEDICI (UNLP)
spelling New thermal and rheological approaches of chickpea–wheat dough for breadmakingBigne, FacundoRomero, AlbertoFerrero, CristinaPuppo, María CeciliaGuerrero, AntonioQuímicaWheatChickpeaRheologyMicrostructureThermal propertiesChickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques.Centro de Investigación y Desarrollo en Criotecnología de Alimentos2021-02-10info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf1107-1115http://sedici.unlp.edu.ar/handle/10915/146371enginfo:eu-repo/semantics/altIdentifier/issn/1438-2377info:eu-repo/semantics/altIdentifier/issn/1438-2385info:eu-repo/semantics/altIdentifier/doi/10.1007/s00217-021-03691-4info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:32:32Zoai:sedici.unlp.edu.ar:10915/146371Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:32:33.081SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title New thermal and rheological approaches of chickpea–wheat dough for breadmaking
spellingShingle New thermal and rheological approaches of chickpea–wheat dough for breadmaking
Bigne, Facundo
Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
title_short New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_full New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_fullStr New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_full_unstemmed New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_sort New thermal and rheological approaches of chickpea–wheat dough for breadmaking
dc.creator.none.fl_str_mv Bigne, Facundo
Romero, Alberto
Ferrero, Cristina
Puppo, María Cecilia
Guerrero, Antonio
author Bigne, Facundo
author_facet Bigne, Facundo
Romero, Alberto
Ferrero, Cristina
Puppo, María Cecilia
Guerrero, Antonio
author_role author
author2 Romero, Alberto
Ferrero, Cristina
Puppo, María Cecilia
Guerrero, Antonio
author2_role author
author
author
author
dc.subject.none.fl_str_mv Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
topic Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
dc.description.none.fl_txt_mv Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques.
Centro de Investigación y Desarrollo en Criotecnología de Alimentos
description Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques.
publishDate 2021
dc.date.none.fl_str_mv 2021-02-10
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
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info:ar-repo/semantics/articulo
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status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/146371
url http://sedici.unlp.edu.ar/handle/10915/146371
dc.language.none.fl_str_mv eng
language eng
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info:eu-repo/semantics/altIdentifier/issn/1438-2385
info:eu-repo/semantics/altIdentifier/doi/10.1007/s00217-021-03691-4
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
dc.format.none.fl_str_mv application/pdf
1107-1115
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
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instname_str Universidad Nacional de La Plata
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institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
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