Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites

Autores
Fornaro, Osvaldo
Año de publicación
2019
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The Sn-Cu system presents an important interest from academic and technological point of view because it is part of the family ofalloys proposed as lead-free solder alloys for electronic components and also due to the mechanisms involved during the growth ofthe different phases. Sn-Cu system has two intermetallic phases, i.e., ε-Cu3Sn and η-Cu6Sn5, and η can be used as the negative(anode) electrode in Li-ion batteries, alone or as part of (Co,Ni)xCu6−xSn5-type composites. Obtaining this η phase from liquidwith the appropriate chemical composition is a very difficult task because it has a formation temperature lower than liquidus forsuch a composition. In this way, the η phase appears as a consequence of a solid-solid transformation from the ε phase However, itis possible to find the η phase as the primary or secondary phase after a eutectic reaction for lower concentrations of Cu. On theother side, the Cu6Sn 5 phase shows a hexagonal to monoclinic solid-solid transformation around 187°C, which could affect themechanical system stability when it is used as solder. In this work, directional solidification at different growth velocities ofhypereutectic Sn-Cu samples was performed. The resultant microstructure varies with the growth velocity, but it is formed for afibber-like primary phase Cu6Sn5 which is projected towards the liquid phase. Behind this region, these fibbers are rounded by atwo-phase Sn-Cu6Sn5 structure. In this way, three zones could to be defined in the sample during the directional growth: (i) anentirely solid two-phase region, formed by η rounded by β(Sn) + η eutectic-like structure, (ii) a two-phase solid (η) + liquid, and(iii) the remnant liquid in front of the interface.
Fil: Fornaro, Osvaldo. Universidad Nacional del Centro de la Provincia de Buenos Aires. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires. - Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires. - Provincia de Buenos Aires. Gobernación. Comisión de Investigaciones Científicas. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina
Materia
SOLIDIFICATION
NUCLEATION
INTERMETALLICS
SOLDER ALLOYS
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/111753
Acceder
id CONICETDig_7e688f7df042fa51a31f70e673fdf75c
oai_identifier_str oai:ri.conicet.gov.ar:11336/111753
network_acronym_str CONICETDig
repository_id_str 3498
network_name_str CONICET Digital (CONICET)
spelling Directional Solidification of Sn-Cu 6 Sn 5 In Situ CompositesFornaro, OsvaldoSOLIDIFICATIONNUCLEATIONINTERMETALLICSSOLDER ALLOYShttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2The Sn-Cu system presents an important interest from academic and technological point of view because it is part of the family ofalloys proposed as lead-free solder alloys for electronic components and also due to the mechanisms involved during the growth ofthe different phases. Sn-Cu system has two intermetallic phases, i.e., ε-Cu3Sn and η-Cu6Sn5, and η can be used as the negative(anode) electrode in Li-ion batteries, alone or as part of (Co,Ni)xCu6−xSn5-type composites. Obtaining this η phase from liquidwith the appropriate chemical composition is a very difficult task because it has a formation temperature lower than liquidus forsuch a composition. In this way, the η phase appears as a consequence of a solid-solid transformation from the ε phase However, itis possible to find the η phase as the primary or secondary phase after a eutectic reaction for lower concentrations of Cu. On theother side, the Cu6Sn 5 phase shows a hexagonal to monoclinic solid-solid transformation around 187°C, which could affect themechanical system stability when it is used as solder. In this work, directional solidification at different growth velocities ofhypereutectic Sn-Cu samples was performed. The resultant microstructure varies with the growth velocity, but it is formed for afibber-like primary phase Cu6Sn5 which is projected towards the liquid phase. Behind this region, these fibbers are rounded by atwo-phase Sn-Cu6Sn5 structure. In this way, three zones could to be defined in the sample during the directional growth: (i) anentirely solid two-phase region, formed by η rounded by β(Sn) + η eutectic-like structure, (ii) a two-phase solid (η) + liquid, and(iii) the remnant liquid in front of the interface.Fil: Fornaro, Osvaldo. Universidad Nacional del Centro de la Provincia de Buenos Aires. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires. - Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires. - Provincia de Buenos Aires. Gobernación. Comisión de Investigaciones Científicas. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; ArgentinaHindawi Publishing Corporation2019-03info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/111753Fornaro, Osvaldo; Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites; Hindawi Publishing Corporation; Advances in Materials Science and Engineering; 2019; 3-2019; 1-81687-8434CONICET DigitalCONICETenginfo:eu-repo/semantics/altIdentifier/url/https://www.hindawi.com/journals/amse/2019/9210713/info:eu-repo/semantics/altIdentifier/doi/10.1155/2019/9210713info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-09-03T09:45:18Zoai:ri.conicet.gov.ar:11336/111753instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-09-03 09:45:18.56CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
title Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
spellingShingle Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
Fornaro, Osvaldo
SOLIDIFICATION
NUCLEATION
INTERMETALLICS
SOLDER ALLOYS
title_short Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
title_full Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
title_fullStr Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
title_full_unstemmed Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
title_sort Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites
dc.creator.none.fl_str_mv Fornaro, Osvaldo
author Fornaro, Osvaldo
author_facet Fornaro, Osvaldo
author_role author
dc.subject.none.fl_str_mv SOLIDIFICATION
NUCLEATION
INTERMETALLICS
SOLDER ALLOYS
topic SOLIDIFICATION
NUCLEATION
INTERMETALLICS
SOLDER ALLOYS
purl_subject.fl_str_mv https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
dc.description.none.fl_txt_mv The Sn-Cu system presents an important interest from academic and technological point of view because it is part of the family ofalloys proposed as lead-free solder alloys for electronic components and also due to the mechanisms involved during the growth ofthe different phases. Sn-Cu system has two intermetallic phases, i.e., ε-Cu3Sn and η-Cu6Sn5, and η can be used as the negative(anode) electrode in Li-ion batteries, alone or as part of (Co,Ni)xCu6−xSn5-type composites. Obtaining this η phase from liquidwith the appropriate chemical composition is a very difficult task because it has a formation temperature lower than liquidus forsuch a composition. In this way, the η phase appears as a consequence of a solid-solid transformation from the ε phase However, itis possible to find the η phase as the primary or secondary phase after a eutectic reaction for lower concentrations of Cu. On theother side, the Cu6Sn 5 phase shows a hexagonal to monoclinic solid-solid transformation around 187°C, which could affect themechanical system stability when it is used as solder. In this work, directional solidification at different growth velocities ofhypereutectic Sn-Cu samples was performed. The resultant microstructure varies with the growth velocity, but it is formed for afibber-like primary phase Cu6Sn5 which is projected towards the liquid phase. Behind this region, these fibbers are rounded by atwo-phase Sn-Cu6Sn5 structure. In this way, three zones could to be defined in the sample during the directional growth: (i) anentirely solid two-phase region, formed by η rounded by β(Sn) + η eutectic-like structure, (ii) a two-phase solid (η) + liquid, and(iii) the remnant liquid in front of the interface.
Fil: Fornaro, Osvaldo. Universidad Nacional del Centro de la Provincia de Buenos Aires. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires. - Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Tandil. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires. - Provincia de Buenos Aires. Gobernación. Comisión de Investigaciones Científicas. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires; Argentina. Universidad Nacional del Centro de la Provincia de Buenos Aires. Facultad de Ciencias Exactas. Instituto de Física de Materiales; Argentina
description The Sn-Cu system presents an important interest from academic and technological point of view because it is part of the family ofalloys proposed as lead-free solder alloys for electronic components and also due to the mechanisms involved during the growth ofthe different phases. Sn-Cu system has two intermetallic phases, i.e., ε-Cu3Sn and η-Cu6Sn5, and η can be used as the negative(anode) electrode in Li-ion batteries, alone or as part of (Co,Ni)xCu6−xSn5-type composites. Obtaining this η phase from liquidwith the appropriate chemical composition is a very difficult task because it has a formation temperature lower than liquidus forsuch a composition. In this way, the η phase appears as a consequence of a solid-solid transformation from the ε phase However, itis possible to find the η phase as the primary or secondary phase after a eutectic reaction for lower concentrations of Cu. On theother side, the Cu6Sn 5 phase shows a hexagonal to monoclinic solid-solid transformation around 187°C, which could affect themechanical system stability when it is used as solder. In this work, directional solidification at different growth velocities ofhypereutectic Sn-Cu samples was performed. The resultant microstructure varies with the growth velocity, but it is formed for afibber-like primary phase Cu6Sn5 which is projected towards the liquid phase. Behind this region, these fibbers are rounded by atwo-phase Sn-Cu6Sn5 structure. In this way, three zones could to be defined in the sample during the directional growth: (i) anentirely solid two-phase region, formed by η rounded by β(Sn) + η eutectic-like structure, (ii) a two-phase solid (η) + liquid, and(iii) the remnant liquid in front of the interface.
publishDate 2019
dc.date.none.fl_str_mv 2019-03
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/111753
Fornaro, Osvaldo; Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites; Hindawi Publishing Corporation; Advances in Materials Science and Engineering; 2019; 3-2019; 1-8
1687-8434
CONICET Digital
CONICET
url http://hdl.handle.net/11336/111753
identifier_str_mv Fornaro, Osvaldo; Directional Solidification of Sn-Cu 6 Sn 5 In Situ Composites; Hindawi Publishing Corporation; Advances in Materials Science and Engineering; 2019; 3-2019; 1-8
1687-8434
CONICET Digital
CONICET
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/url/https://www.hindawi.com/journals/amse/2019/9210713/
info:eu-repo/semantics/altIdentifier/doi/10.1155/2019/9210713
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
https://creativecommons.org/licenses/by/2.5/ar/
eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv Hindawi Publishing Corporation
publisher.none.fl_str_mv Hindawi Publishing Corporation
dc.source.none.fl_str_mv reponame:CONICET Digital (CONICET)
instname:Consejo Nacional de Investigaciones Científicas y Técnicas
reponame_str CONICET Digital (CONICET)
collection CONICET Digital (CONICET)
instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
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score 13.13397

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