Directional Solidification of Sn-Ag-Cu Alloys
- Autores
- Fornaro, Osvaldo; Morando, Carina; Garbellini, Olga Beatriz; Palacio, Hugo Anibal
- Año de publicación
- 2015
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- The alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth.
International Congress of Science and Technology of Metallurgy and Materials, SAM - CONAMET 2013 - Materia
-
Ingeniería de los Materiales
Solidification
Lead-free alloys
SAC alloys - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by-nc-nd/4.0/
- Repositorio
- Institución
- Comisión de Investigaciones Científicas de la Provincia de Buenos Aires
- OAI Identificador
- oai:digital.cic.gba.gob.ar:11746/5882
Ver los metadatos del registro completo
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Directional Solidification of Sn-Ag-Cu AlloysFornaro, OsvaldoMorando, CarinaGarbellini, Olga BeatrizPalacio, Hugo AnibalIngeniería de los MaterialesSolidificationLead-free alloysSAC alloysThe alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth.International Congress of Science and Technology of Metallurgy and Materials, SAM - CONAMET 2013Elsevier2015info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfhttps://digital.cic.gba.gob.ar/handle/11746/5882enginfo:eu-repo/semantics/altIdentifier/doi/10.1016/j.mspro.2015.04.155info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-nd/4.0/reponame:CIC Digital (CICBA)instname:Comisión de Investigaciones Científicas de la Provincia de Buenos Airesinstacron:CICBA2025-09-04T09:43:39Zoai:digital.cic.gba.gob.ar:11746/5882Institucionalhttp://digital.cic.gba.gob.arOrganismo científico-tecnológicoNo correspondehttp://digital.cic.gba.gob.ar/oai/snrdmarisa.degiusti@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:94412025-09-04 09:43:40.275CIC Digital (CICBA) - Comisión de Investigaciones Científicas de la Provincia de Buenos Airesfalse |
dc.title.none.fl_str_mv |
Directional Solidification of Sn-Ag-Cu Alloys |
title |
Directional Solidification of Sn-Ag-Cu Alloys |
spellingShingle |
Directional Solidification of Sn-Ag-Cu Alloys Fornaro, Osvaldo Ingeniería de los Materiales Solidification Lead-free alloys SAC alloys |
title_short |
Directional Solidification of Sn-Ag-Cu Alloys |
title_full |
Directional Solidification of Sn-Ag-Cu Alloys |
title_fullStr |
Directional Solidification of Sn-Ag-Cu Alloys |
title_full_unstemmed |
Directional Solidification of Sn-Ag-Cu Alloys |
title_sort |
Directional Solidification of Sn-Ag-Cu Alloys |
dc.creator.none.fl_str_mv |
Fornaro, Osvaldo Morando, Carina Garbellini, Olga Beatriz Palacio, Hugo Anibal |
author |
Fornaro, Osvaldo |
author_facet |
Fornaro, Osvaldo Morando, Carina Garbellini, Olga Beatriz Palacio, Hugo Anibal |
author_role |
author |
author2 |
Morando, Carina Garbellini, Olga Beatriz Palacio, Hugo Anibal |
author2_role |
author author author |
dc.subject.none.fl_str_mv |
Ingeniería de los Materiales Solidification Lead-free alloys SAC alloys |
topic |
Ingeniería de los Materiales Solidification Lead-free alloys SAC alloys |
dc.description.none.fl_txt_mv |
The alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth. International Congress of Science and Technology of Metallurgy and Materials, SAM - CONAMET 2013 |
description |
The alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth. |
publishDate |
2015 |
dc.date.none.fl_str_mv |
2015 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
https://digital.cic.gba.gob.ar/handle/11746/5882 |
url |
https://digital.cic.gba.gob.ar/handle/11746/5882 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.mspro.2015.04.155 |
dc.rights.none.fl_str_mv |
info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by-nc-nd/4.0/ |
eu_rights_str_mv |
openAccess |
rights_invalid_str_mv |
http://creativecommons.org/licenses/by-nc-nd/4.0/ |
dc.format.none.fl_str_mv |
application/pdf |
dc.publisher.none.fl_str_mv |
Elsevier |
publisher.none.fl_str_mv |
Elsevier |
dc.source.none.fl_str_mv |
reponame:CIC Digital (CICBA) instname:Comisión de Investigaciones Científicas de la Provincia de Buenos Aires instacron:CICBA |
reponame_str |
CIC Digital (CICBA) |
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CIC Digital (CICBA) |
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Comisión de Investigaciones Científicas de la Provincia de Buenos Aires |
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CICBA |
institution |
CICBA |
repository.name.fl_str_mv |
CIC Digital (CICBA) - Comisión de Investigaciones Científicas de la Provincia de Buenos Aires |
repository.mail.fl_str_mv |
marisa.degiusti@sedici.unlp.edu.ar |
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score |
12.623145 |