Directional Solidification of Sn-Ag-Cu Alloys

Autores
Fornaro, Osvaldo; Morando, Carina; Garbellini, Olga Beatriz; Palacio, Hugo Anibal
Año de publicación
2015
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth.
International Congress of Science and Technology of Metallurgy and Materials, SAM - CONAMET 2013
Materia
Ingeniería de los Materiales
Solidification
Lead-free alloys
SAC alloys
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by-nc-nd/4.0/
Repositorio
CIC Digital (CICBA)
Institución
Comisión de Investigaciones Científicas de la Provincia de Buenos Aires
OAI Identificador
oai:digital.cic.gba.gob.ar:11746/5882

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oai_identifier_str oai:digital.cic.gba.gob.ar:11746/5882
network_acronym_str CICBA
repository_id_str 9441
network_name_str CIC Digital (CICBA)
spelling Directional Solidification of Sn-Ag-Cu AlloysFornaro, OsvaldoMorando, CarinaGarbellini, Olga BeatrizPalacio, Hugo AnibalIngeniería de los MaterialesSolidificationLead-free alloysSAC alloysThe alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth.International Congress of Science and Technology of Metallurgy and Materials, SAM - CONAMET 2013Elsevier2015info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfhttps://digital.cic.gba.gob.ar/handle/11746/5882enginfo:eu-repo/semantics/altIdentifier/doi/10.1016/j.mspro.2015.04.155info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-nd/4.0/reponame:CIC Digital (CICBA)instname:Comisión de Investigaciones Científicas de la Provincia de Buenos Airesinstacron:CICBA2025-09-04T09:43:39Zoai:digital.cic.gba.gob.ar:11746/5882Institucionalhttp://digital.cic.gba.gob.arOrganismo científico-tecnológicoNo correspondehttp://digital.cic.gba.gob.ar/oai/snrdmarisa.degiusti@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:94412025-09-04 09:43:40.275CIC Digital (CICBA) - Comisión de Investigaciones Científicas de la Provincia de Buenos Airesfalse
dc.title.none.fl_str_mv Directional Solidification of Sn-Ag-Cu Alloys
title Directional Solidification of Sn-Ag-Cu Alloys
spellingShingle Directional Solidification of Sn-Ag-Cu Alloys
Fornaro, Osvaldo
Ingeniería de los Materiales
Solidification
Lead-free alloys
SAC alloys
title_short Directional Solidification of Sn-Ag-Cu Alloys
title_full Directional Solidification of Sn-Ag-Cu Alloys
title_fullStr Directional Solidification of Sn-Ag-Cu Alloys
title_full_unstemmed Directional Solidification of Sn-Ag-Cu Alloys
title_sort Directional Solidification of Sn-Ag-Cu Alloys
dc.creator.none.fl_str_mv Fornaro, Osvaldo
Morando, Carina
Garbellini, Olga Beatriz
Palacio, Hugo Anibal
author Fornaro, Osvaldo
author_facet Fornaro, Osvaldo
Morando, Carina
Garbellini, Olga Beatriz
Palacio, Hugo Anibal
author_role author
author2 Morando, Carina
Garbellini, Olga Beatriz
Palacio, Hugo Anibal
author2_role author
author
author
dc.subject.none.fl_str_mv Ingeniería de los Materiales
Solidification
Lead-free alloys
SAC alloys
topic Ingeniería de los Materiales
Solidification
Lead-free alloys
SAC alloys
dc.description.none.fl_txt_mv The alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth.
International Congress of Science and Technology of Metallurgy and Materials, SAM - CONAMET 2013
description The alloys of Sn-Ag-Cu family (SAC) are candidates for lead-free replacement of Sn-Pb eutectic used in welding processes of electronic devices. These alloys, with eventual adding of Zn, In and Bi highly improves the morphological stability and the corrosion resistance. Close to the eutectic ternary composition, the solidification occurs with three distinct phases: Sn-rich dendritic primary phase, Ag3Sn and Cu6Sn5 intermetallic phases, which have limited solubility in the Sn phase, in such a way that some authors consider these alloys as compounds of Sn with the mentioned intermetallic phases. In this aspect, the directional solidification is a suitable tool to study the solidification under strictly controlled conditions. In this work, samples of Sn-Ag-Cu composition were grown to analyze the mechanisms involved in the solidification of these alloys. The typical microstructure agrees the above description, with a spacing that depends mainly on the advance interface velocity of the growth.
publishDate 2015
dc.date.none.fl_str_mv 2015
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv https://digital.cic.gba.gob.ar/handle/11746/5882
url https://digital.cic.gba.gob.ar/handle/11746/5882
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/doi/10.1016/j.mspro.2015.04.155
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by-nc-nd/4.0/
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-nd/4.0/
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
dc.source.none.fl_str_mv reponame:CIC Digital (CICBA)
instname:Comisión de Investigaciones Científicas de la Provincia de Buenos Aires
instacron:CICBA
reponame_str CIC Digital (CICBA)
collection CIC Digital (CICBA)
instname_str Comisión de Investigaciones Científicas de la Provincia de Buenos Aires
instacron_str CICBA
institution CICBA
repository.name.fl_str_mv CIC Digital (CICBA) - Comisión de Investigaciones Científicas de la Provincia de Buenos Aires
repository.mail.fl_str_mv marisa.degiusti@sedici.unlp.edu.ar
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