Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
- Autores
- Haseeb, A. S. M. A.; Schilardi, Patricia Laura; Bolzán, Agustín Eduardo; Piatti, Roberto C. V.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
- Año de publicación
- 2001
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas - Materia
-
Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by-nc-sa/4.0/
- Repositorio
- Institución
- Universidad Nacional de La Plata
- OAI Identificador
- oai:sedici.unlp.edu.ar:10915/118894
Ver los metadatos del registro completo
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Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growthHaseeb, A. S. M. A.Schilardi, Patricia LauraBolzán, Agustín EduardoPiatti, Roberto C. V.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaAnodic copper dissolutionThioureaCorrosion inhibitorThe formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas2001info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf543-553http://sedici.unlp.edu.ar/handle/10915/118894enginfo:eu-repo/semantics/altIdentifier/issn/0022-0728info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00216-3info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:28:00Zoai:sedici.unlp.edu.ar:10915/118894Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:28:00.78SEDICI (UNLP) - Universidad Nacional de La Platafalse |
dc.title.none.fl_str_mv |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth |
title |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth |
spellingShingle |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth Haseeb, A. S. M. A. Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor |
title_short |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth |
title_full |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth |
title_fullStr |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth |
title_full_unstemmed |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth |
title_sort |
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth |
dc.creator.none.fl_str_mv |
Haseeb, A. S. M. A. Schilardi, Patricia Laura Bolzán, Agustín Eduardo Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author |
Haseeb, A. S. M. A. |
author_facet |
Haseeb, A. S. M. A. Schilardi, Patricia Laura Bolzán, Agustín Eduardo Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author_role |
author |
author2 |
Schilardi, Patricia Laura Bolzán, Agustín Eduardo Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author2_role |
author author author author author |
dc.subject.none.fl_str_mv |
Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor |
topic |
Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor |
dc.description.none.fl_txt_mv |
The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas |
description |
The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed. |
publishDate |
2001 |
dc.date.none.fl_str_mv |
2001 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion Articulo http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://sedici.unlp.edu.ar/handle/10915/118894 |
url |
http://sedici.unlp.edu.ar/handle/10915/118894 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
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info:eu-repo/semantics/altIdentifier/issn/0022-0728 info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00216-3 |
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info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by-nc-sa/4.0/ Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) |
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openAccess |
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http://creativecommons.org/licenses/by-nc-sa/4.0/ Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) |
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