Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth

Autores
Haseeb, A. S. M. A.; Schilardi, Patricia Laura; Bolzán, Agustín Eduardo; Piatti, Roberto C. V.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
2001
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Materia
Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by-nc-sa/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/118894

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network_name_str SEDICI (UNLP)
spelling Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growthHaseeb, A. S. M. A.Schilardi, Patricia LauraBolzán, Agustín EduardoPiatti, Roberto C. V.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaAnodic copper dissolutionThioureaCorrosion inhibitorThe formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas2001info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf543-553http://sedici.unlp.edu.ar/handle/10915/118894enginfo:eu-repo/semantics/altIdentifier/issn/0022-0728info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00216-3info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:28:00Zoai:sedici.unlp.edu.ar:10915/118894Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:28:00.78SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
spellingShingle Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
Haseeb, A. S. M. A.
Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
title_short Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_full Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_fullStr Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_full_unstemmed Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_sort Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
dc.creator.none.fl_str_mv Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Bolzán, Agustín Eduardo
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Haseeb, A. S. M. A.
author_facet Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Bolzán, Agustín Eduardo
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 Schilardi, Patricia Laura
Bolzán, Agustín Eduardo
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
author
author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
topic Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
dc.description.none.fl_txt_mv The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
description The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed.
publishDate 2001
dc.date.none.fl_str_mv 2001
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/118894
url http://sedici.unlp.edu.ar/handle/10915/118894
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/0022-0728
info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00216-3
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
dc.format.none.fl_str_mv application/pdf
543-553
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instname:Universidad Nacional de La Plata
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repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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