Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
- Autores
- Bolzán, Agustín Eduardo; Haseeb, A. S. M. A.; Schilardi, Patricia Laura; Piatti, Roberto C. V.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
- Año de publicación
- 2001
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas - Materia
-
Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by-nc-sa/4.0/
- Repositorio
- Institución
- Universidad Nacional de La Plata
- OAI Identificador
- oai:sedici.unlp.edu.ar:10915/118899
Ver los metadatos del registro completo
id |
SEDICI_1270899ec1303ff9b8804437a17ce40e |
---|---|
oai_identifier_str |
oai:sedici.unlp.edu.ar:10915/118899 |
network_acronym_str |
SEDICI |
repository_id_str |
1329 |
network_name_str |
SEDICI (UNLP) |
spelling |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathwayBolzán, Agustín EduardoHaseeb, A. S. M. A.Schilardi, Patricia LauraPiatti, Roberto C. V.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaAnodic copper dissolutionThioureaCorrosion inhibitorThe anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas2001info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf533-542http://sedici.unlp.edu.ar/handle/10915/118899enginfo:eu-repo/semantics/altIdentifier/issn/0022-0728info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00217-5info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:28:00Zoai:sedici.unlp.edu.ar:10915/118899Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:28:00.792SEDICI (UNLP) - Universidad Nacional de La Platafalse |
dc.title.none.fl_str_mv |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway |
title |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway |
spellingShingle |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway Bolzán, Agustín Eduardo Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor |
title_short |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway |
title_full |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway |
title_fullStr |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway |
title_full_unstemmed |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway |
title_sort |
Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway |
dc.creator.none.fl_str_mv |
Bolzán, Agustín Eduardo Haseeb, A. S. M. A. Schilardi, Patricia Laura Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author |
Bolzán, Agustín Eduardo |
author_facet |
Bolzán, Agustín Eduardo Haseeb, A. S. M. A. Schilardi, Patricia Laura Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author_role |
author |
author2 |
Haseeb, A. S. M. A. Schilardi, Patricia Laura Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author2_role |
author author author author author |
dc.subject.none.fl_str_mv |
Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor |
topic |
Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor |
dc.description.none.fl_txt_mv |
The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas |
description |
The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced. |
publishDate |
2001 |
dc.date.none.fl_str_mv |
2001 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion Articulo http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://sedici.unlp.edu.ar/handle/10915/118899 |
url |
http://sedici.unlp.edu.ar/handle/10915/118899 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/issn/0022-0728 info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00217-5 |
dc.rights.none.fl_str_mv |
info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by-nc-sa/4.0/ Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) |
eu_rights_str_mv |
openAccess |
rights_invalid_str_mv |
http://creativecommons.org/licenses/by-nc-sa/4.0/ Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) |
dc.format.none.fl_str_mv |
application/pdf 533-542 |
dc.source.none.fl_str_mv |
reponame:SEDICI (UNLP) instname:Universidad Nacional de La Plata instacron:UNLP |
reponame_str |
SEDICI (UNLP) |
collection |
SEDICI (UNLP) |
instname_str |
Universidad Nacional de La Plata |
instacron_str |
UNLP |
institution |
UNLP |
repository.name.fl_str_mv |
SEDICI (UNLP) - Universidad Nacional de La Plata |
repository.mail.fl_str_mv |
alira@sedici.unlp.edu.ar |
_version_ |
1844616158325506048 |
score |
13.070432 |