Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway

Autores
Bolzán, Agustín Eduardo; Haseeb, A. S. M. A.; Schilardi, Patricia Laura; Piatti, Roberto C. V.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
2001
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Materia
Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by-nc-sa/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/118899

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network_name_str SEDICI (UNLP)
spelling Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathwayBolzán, Agustín EduardoHaseeb, A. S. M. A.Schilardi, Patricia LauraPiatti, Roberto C. V.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaAnodic copper dissolutionThioureaCorrosion inhibitorThe anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas2001info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf533-542http://sedici.unlp.edu.ar/handle/10915/118899enginfo:eu-repo/semantics/altIdentifier/issn/0022-0728info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00217-5info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:28:00Zoai:sedici.unlp.edu.ar:10915/118899Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:28:00.792SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
spellingShingle Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
Bolzán, Agustín Eduardo
Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
title_short Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_full Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_fullStr Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_full_unstemmed Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_sort Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
dc.creator.none.fl_str_mv Bolzán, Agustín Eduardo
Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Bolzán, Agustín Eduardo
author_facet Bolzán, Agustín Eduardo
Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
author
author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
topic Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
dc.description.none.fl_txt_mv The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
description The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced.
publishDate 2001
dc.date.none.fl_str_mv 2001
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
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info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/118899
url http://sedici.unlp.edu.ar/handle/10915/118899
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/0022-0728
info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00217-5
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
dc.format.none.fl_str_mv application/pdf
533-542
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
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