Inverse hall-petch relationship in nanocrystalline tantalum

Autores
Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.
Año de publicación
2013
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nmFil: Tang, Yizhe. University Of California At San Diego; Estados Unidos;
Fil: Bringa, Eduardo Marcial. Universidad Nacional de Cuyo. Facultad de Ciencias Exactas y Naturales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Mendoza; Argentina
Fil: Meyers, Marc A.. University Of California At San Diego; Estados Unidos;
Materia
BCC METAL
GRAIN-SIZE EFFECT
INVERSE HALL-PETCH RELATIONSHIP
MOLECULAR DYNAMICS
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/2250

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network_name_str CONICET Digital (CONICET)
spelling Inverse hall-petch relationship in nanocrystalline tantalumTang, YizheBringa, Eduardo MarcialMeyers, Marc A.BCC METALGRAIN-SIZE EFFECTINVERSE HALL-PETCH RELATIONSHIPMOLECULAR DYNAMICShttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nm<d <30 nm region. This inverse Hall?Petch relationship is analyzed in terms of the contributions of dislocation motion and grain-boundary shear to plastic deformation. As the grain size is increased the contribution of grain-boundary sliding is decreased and plastic strain is accommodated by dislocation and motion. In tensile deformation, on the other hand, this behavior is not observed.Fil: Tang, Yizhe. University Of California At San Diego; Estados Unidos;Fil: Bringa, Eduardo Marcial. Universidad Nacional de Cuyo. Facultad de Ciencias Exactas y Naturales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Mendoza; ArgentinaFil: Meyers, Marc A.. University Of California At San Diego; Estados Unidos;Elsevier Science SA2013-09-15info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/2250Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.; Inverse hall-petch relationship in nanocrystalline tantalum; Elsevier Science SA; Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing; 580; 15-9-2013; 414-4260921-5093enginfo:eu-repo/semantics/altIdentifier/doi/10.1016/j.msea.2013.05.024info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by-nc-sa/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-09-29T09:40:45Zoai:ri.conicet.gov.ar:11336/2250instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-09-29 09:40:45.591CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Inverse hall-petch relationship in nanocrystalline tantalum
title Inverse hall-petch relationship in nanocrystalline tantalum
spellingShingle Inverse hall-petch relationship in nanocrystalline tantalum
Tang, Yizhe
BCC METAL
GRAIN-SIZE EFFECT
INVERSE HALL-PETCH RELATIONSHIP
MOLECULAR DYNAMICS
title_short Inverse hall-petch relationship in nanocrystalline tantalum
title_full Inverse hall-petch relationship in nanocrystalline tantalum
title_fullStr Inverse hall-petch relationship in nanocrystalline tantalum
title_full_unstemmed Inverse hall-petch relationship in nanocrystalline tantalum
title_sort Inverse hall-petch relationship in nanocrystalline tantalum
dc.creator.none.fl_str_mv Tang, Yizhe
Bringa, Eduardo Marcial
Meyers, Marc A.
author Tang, Yizhe
author_facet Tang, Yizhe
Bringa, Eduardo Marcial
Meyers, Marc A.
author_role author
author2 Bringa, Eduardo Marcial
Meyers, Marc A.
author2_role author
author
dc.subject.none.fl_str_mv BCC METAL
GRAIN-SIZE EFFECT
INVERSE HALL-PETCH RELATIONSHIP
MOLECULAR DYNAMICS
topic BCC METAL
GRAIN-SIZE EFFECT
INVERSE HALL-PETCH RELATIONSHIP
MOLECULAR DYNAMICS
purl_subject.fl_str_mv https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
dc.description.none.fl_txt_mv Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nm<d <30 nm region. This inverse Hall?Petch relationship is analyzed in terms of the contributions of dislocation motion and grain-boundary shear to plastic deformation. As the grain size is increased the contribution of grain-boundary sliding is decreased and plastic strain is accommodated by dislocation and motion. In tensile deformation, on the other hand, this behavior is not observed.
Fil: Tang, Yizhe. University Of California At San Diego; Estados Unidos;
Fil: Bringa, Eduardo Marcial. Universidad Nacional de Cuyo. Facultad de Ciencias Exactas y Naturales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Mendoza; Argentina
Fil: Meyers, Marc A.. University Of California At San Diego; Estados Unidos;
description Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nm<d <30 nm region. This inverse Hall?Petch relationship is analyzed in terms of the contributions of dislocation motion and grain-boundary shear to plastic deformation. As the grain size is increased the contribution of grain-boundary sliding is decreased and plastic strain is accommodated by dislocation and motion. In tensile deformation, on the other hand, this behavior is not observed.
publishDate 2013
dc.date.none.fl_str_mv 2013-09-15
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/2250
Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.; Inverse hall-petch relationship in nanocrystalline tantalum; Elsevier Science SA; Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing; 580; 15-9-2013; 414-426
0921-5093
url http://hdl.handle.net/11336/2250
identifier_str_mv Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.; Inverse hall-petch relationship in nanocrystalline tantalum; Elsevier Science SA; Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing; 580; 15-9-2013; 414-426
0921-5093
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/doi/10.1016/j.msea.2013.05.024
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv Elsevier Science SA
publisher.none.fl_str_mv Elsevier Science SA
dc.source.none.fl_str_mv reponame:CONICET Digital (CONICET)
instname:Consejo Nacional de Investigaciones Científicas y Técnicas
reponame_str CONICET Digital (CONICET)
collection CONICET Digital (CONICET)
instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
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