Inverse hall-petch relationship in nanocrystalline tantalum
- Autores
- Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.
- Año de publicación
- 2013
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nm
Fil: Tang, Yizhe. University Of California At San Diego; Estados Unidos;
Fil: Bringa, Eduardo Marcial. Universidad Nacional de Cuyo. Facultad de Ciencias Exactas y Naturales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Mendoza; Argentina
Fil: Meyers, Marc A.. University Of California At San Diego; Estados Unidos; - Materia
-
BCC METAL
GRAIN-SIZE EFFECT
INVERSE HALL-PETCH RELATIONSHIP
MOLECULAR DYNAMICS - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
- Repositorio
- Institución
- Consejo Nacional de Investigaciones Científicas y Técnicas
- OAI Identificador
- oai:ri.conicet.gov.ar:11336/2250
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Inverse hall-petch relationship in nanocrystalline tantalumTang, YizheBringa, Eduardo MarcialMeyers, Marc A.BCC METALGRAIN-SIZE EFFECTINVERSE HALL-PETCH RELATIONSHIPMOLECULAR DYNAMICShttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nm<d <30 nm region. This inverse Hall?Petch relationship is analyzed in terms of the contributions of dislocation motion and grain-boundary shear to plastic deformation. As the grain size is increased the contribution of grain-boundary sliding is decreased and plastic strain is accommodated by dislocation and motion. In tensile deformation, on the other hand, this behavior is not observed.Fil: Tang, Yizhe. University Of California At San Diego; Estados Unidos;Fil: Bringa, Eduardo Marcial. Universidad Nacional de Cuyo. Facultad de Ciencias Exactas y Naturales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Mendoza; ArgentinaFil: Meyers, Marc A.. University Of California At San Diego; Estados Unidos;Elsevier Science SA2013-09-15info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/2250Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.; Inverse hall-petch relationship in nanocrystalline tantalum; Elsevier Science SA; Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing; 580; 15-9-2013; 414-4260921-5093enginfo:eu-repo/semantics/altIdentifier/doi/10.1016/j.msea.2013.05.024info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by-nc-sa/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-09-29T09:40:45Zoai:ri.conicet.gov.ar:11336/2250instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-09-29 09:40:45.591CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse |
dc.title.none.fl_str_mv |
Inverse hall-petch relationship in nanocrystalline tantalum |
title |
Inverse hall-petch relationship in nanocrystalline tantalum |
spellingShingle |
Inverse hall-petch relationship in nanocrystalline tantalum Tang, Yizhe BCC METAL GRAIN-SIZE EFFECT INVERSE HALL-PETCH RELATIONSHIP MOLECULAR DYNAMICS |
title_short |
Inverse hall-petch relationship in nanocrystalline tantalum |
title_full |
Inverse hall-petch relationship in nanocrystalline tantalum |
title_fullStr |
Inverse hall-petch relationship in nanocrystalline tantalum |
title_full_unstemmed |
Inverse hall-petch relationship in nanocrystalline tantalum |
title_sort |
Inverse hall-petch relationship in nanocrystalline tantalum |
dc.creator.none.fl_str_mv |
Tang, Yizhe Bringa, Eduardo Marcial Meyers, Marc A. |
author |
Tang, Yizhe |
author_facet |
Tang, Yizhe Bringa, Eduardo Marcial Meyers, Marc A. |
author_role |
author |
author2 |
Bringa, Eduardo Marcial Meyers, Marc A. |
author2_role |
author author |
dc.subject.none.fl_str_mv |
BCC METAL GRAIN-SIZE EFFECT INVERSE HALL-PETCH RELATIONSHIP MOLECULAR DYNAMICS |
topic |
BCC METAL GRAIN-SIZE EFFECT INVERSE HALL-PETCH RELATIONSHIP MOLECULAR DYNAMICS |
purl_subject.fl_str_mv |
https://purl.org/becyt/ford/2.5 https://purl.org/becyt/ford/2 |
dc.description.none.fl_txt_mv |
Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nm<d <30 nm region. This inverse Hall?Petch relationship is analyzed in terms of the contributions of dislocation motion and grain-boundary shear to plastic deformation. As the grain size is increased the contribution of grain-boundary sliding is decreased and plastic strain is accommodated by dislocation and motion. In tensile deformation, on the other hand, this behavior is not observed. Fil: Tang, Yizhe. University Of California At San Diego; Estados Unidos; Fil: Bringa, Eduardo Marcial. Universidad Nacional de Cuyo. Facultad de Ciencias Exactas y Naturales; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Mendoza; Argentina Fil: Meyers, Marc A.. University Of California At San Diego; Estados Unidos; |
description |
Tantalum polycrystals (grain sizes varying from 2.5 to 30 nm) generated by Voronoi tessellation were subjected to tension and compression under uniaxial strain loading at strain rates on the order of 108–109 s−1 using molecular dynamics (MD) simulations. In contrast with MD simulations of FCC metals, the response in tension is significantly different from that in compression. In tension, fracture is initiated at grain boundaries perpendicular to the loading direction. It propagates along grain boundaries with limited plastic deformation, at a stress in the range 10–14 GPa. This brittle intergranular failure is a consequence of the high strain rate imposed by MD, leading to a stress that exceeds the grain-boundary cohesive strength. Thus, grain-boundary separation is the principal failure mechanism. In compression, on the other hand, there is considerable plastic deformation within the grains. This occurs at stresses higher than failure in tension. The difference between tensile and compressive response for tantalum is attributed to the difficulty in generating dislocations, in contrast with FCC metals, where tensile failure occurs by void nucleation at grain boundaries associated with partial and perfect dislocation emission. In BCC tantalum, both grain-boundary sliding and dislocation emission are much more difficult. The compressive yield stress is found to increase with grain size in the 2.5 nmThe compressive yield stress is found to increase with grain size in the 2.5 nm<d <30 nm region. This inverse Hall?Petch relationship is analyzed in terms of the contributions of dislocation motion and grain-boundary shear to plastic deformation. As the grain size is increased the contribution of grain-boundary sliding is decreased and plastic strain is accommodated by dislocation and motion. In tensile deformation, on the other hand, this behavior is not observed. |
publishDate |
2013 |
dc.date.none.fl_str_mv |
2013-09-15 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://hdl.handle.net/11336/2250 Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.; Inverse hall-petch relationship in nanocrystalline tantalum; Elsevier Science SA; Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing; 580; 15-9-2013; 414-426 0921-5093 |
url |
http://hdl.handle.net/11336/2250 |
identifier_str_mv |
Tang, Yizhe; Bringa, Eduardo Marcial; Meyers, Marc A.; Inverse hall-petch relationship in nanocrystalline tantalum; Elsevier Science SA; Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing; 580; 15-9-2013; 414-426 0921-5093 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.msea.2013.05.024 |
dc.rights.none.fl_str_mv |
info:eu-repo/semantics/openAccess https://creativecommons.org/licenses/by-nc-sa/2.5/ar/ |
eu_rights_str_mv |
openAccess |
rights_invalid_str_mv |
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/ |
dc.format.none.fl_str_mv |
application/pdf application/pdf |
dc.publisher.none.fl_str_mv |
Elsevier Science SA |
publisher.none.fl_str_mv |
Elsevier Science SA |
dc.source.none.fl_str_mv |
reponame:CONICET Digital (CONICET) instname:Consejo Nacional de Investigaciones Científicas y Técnicas |
reponame_str |
CONICET Digital (CONICET) |
collection |
CONICET Digital (CONICET) |
instname_str |
Consejo Nacional de Investigaciones Científicas y Técnicas |
repository.name.fl_str_mv |
CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas |
repository.mail.fl_str_mv |
dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar |
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1844613289575710720 |
score |
13.070432 |