Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System

Autores
Tumminello, Silvana Deisy Paulina; Sommadossi, Silvana Andrea
Año de publicación
2012
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
New processes and materials are vital nowadays, since specific features of materials are essential to accomplish the more demanding technological and environmental requirements. Al/Ni system has stimulated a large number of phase equilibrium, thermodynamic, diffusion and related studies. Its relevance relays on first principle features as well as technological importance. Transient Liquid Phase Bonding (TLPB) process is presented in this work due to the advantages of this method above others. Low temperatures of processing are needed, to obtain stable intermetallic phases (IPs) suitable for high temperatures of service. The aim of this research is to investigate the impact of temperature on the IPs growth and formation mechanisms, completing previous works on microstructure and kinetics characterization of IPs in Al/Ni system at 720°C. The results of SEMEDS/ WDS analyses of the cross-sections of the bonds showed the presence of Al3Ni and Al3Ni2 at the beginning of the interaction between Al and Ni, which are consistent with the phase equilibrium diagram. The Al3Ni2 layer growth showed linear correlation with time at 800°C, whereas at 900 and 1000°C it suggested a diffusive growth. Inert markers experiments allowed distinguishing individual growth. Vickers micro-hardness was determined obtaining values for Ni and Al3Ni2 of about 100 and 800 HV/ 0.025, respectively.
Fil: Tumminello, Silvana Deisy Paulina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Patagonia Norte. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas. Universidad Nacional del Comahue. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas; Argentina
Fil: Sommadossi, Silvana Andrea. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Patagonia Norte. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas. Universidad Nacional del Comahue. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas; Argentina
Materia
NI-AL
INTERMETALLICS
TLPB
KINETICS
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/269485
Acceder
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network_name_str CONICET Digital (CONICET)
spelling Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni SystemTumminello, Silvana Deisy PaulinaSommadossi, Silvana AndreaNI-ALINTERMETALLICSTLPBKINETICShttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2New processes and materials are vital nowadays, since specific features of materials are essential to accomplish the more demanding technological and environmental requirements. Al/Ni system has stimulated a large number of phase equilibrium, thermodynamic, diffusion and related studies. Its relevance relays on first principle features as well as technological importance. Transient Liquid Phase Bonding (TLPB) process is presented in this work due to the advantages of this method above others. Low temperatures of processing are needed, to obtain stable intermetallic phases (IPs) suitable for high temperatures of service. The aim of this research is to investigate the impact of temperature on the IPs growth and formation mechanisms, completing previous works on microstructure and kinetics characterization of IPs in Al/Ni system at 720°C. The results of SEMEDS/ WDS analyses of the cross-sections of the bonds showed the presence of Al3Ni and Al3Ni2 at the beginning of the interaction between Al and Ni, which are consistent with the phase equilibrium diagram. The Al3Ni2 layer growth showed linear correlation with time at 800°C, whereas at 900 and 1000°C it suggested a diffusive growth. Inert markers experiments allowed distinguishing individual growth. Vickers micro-hardness was determined obtaining values for Ni and Al3Ni2 of about 100 and 800 HV/ 0.025, respectively.Fil: Tumminello, Silvana Deisy Paulina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Patagonia Norte. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas. Universidad Nacional del Comahue. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas; ArgentinaFil: Sommadossi, Silvana Andrea. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Patagonia Norte. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas. Universidad Nacional del Comahue. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas; ArgentinaTrans Tech Publications2012-04info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/269485Tumminello, Silvana Deisy Paulina; Sommadossi, Silvana Andrea; Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System; Trans Tech Publications; Defect and Diffusion Forum; 323-325; 4-2012; 465-4701662-9507CONICET DigitalCONICETenginfo:eu-repo/semantics/altIdentifier/url/http://www.scientific.net/DDF.323-325.465info:eu-repo/semantics/altIdentifier/doi/10.4028/www.scientific.net/DDF.323-325.465info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by-nc-sa/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-09-29T09:36:27Zoai:ri.conicet.gov.ar:11336/269485instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-09-29 09:36:28.086CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
title Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
spellingShingle Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
Tumminello, Silvana Deisy Paulina
NI-AL
INTERMETALLICS
TLPB
KINETICS
title_short Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
title_full Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
title_fullStr Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
title_full_unstemmed Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
title_sort Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System
dc.creator.none.fl_str_mv Tumminello, Silvana Deisy Paulina
Sommadossi, Silvana Andrea
author Tumminello, Silvana Deisy Paulina
author_facet Tumminello, Silvana Deisy Paulina
Sommadossi, Silvana Andrea
author_role author
author2 Sommadossi, Silvana Andrea
author2_role author
dc.subject.none.fl_str_mv NI-AL
INTERMETALLICS
TLPB
KINETICS
topic NI-AL
INTERMETALLICS
TLPB
KINETICS
purl_subject.fl_str_mv https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
dc.description.none.fl_txt_mv New processes and materials are vital nowadays, since specific features of materials are essential to accomplish the more demanding technological and environmental requirements. Al/Ni system has stimulated a large number of phase equilibrium, thermodynamic, diffusion and related studies. Its relevance relays on first principle features as well as technological importance. Transient Liquid Phase Bonding (TLPB) process is presented in this work due to the advantages of this method above others. Low temperatures of processing are needed, to obtain stable intermetallic phases (IPs) suitable for high temperatures of service. The aim of this research is to investigate the impact of temperature on the IPs growth and formation mechanisms, completing previous works on microstructure and kinetics characterization of IPs in Al/Ni system at 720°C. The results of SEMEDS/ WDS analyses of the cross-sections of the bonds showed the presence of Al3Ni and Al3Ni2 at the beginning of the interaction between Al and Ni, which are consistent with the phase equilibrium diagram. The Al3Ni2 layer growth showed linear correlation with time at 800°C, whereas at 900 and 1000°C it suggested a diffusive growth. Inert markers experiments allowed distinguishing individual growth. Vickers micro-hardness was determined obtaining values for Ni and Al3Ni2 of about 100 and 800 HV/ 0.025, respectively.
Fil: Tumminello, Silvana Deisy Paulina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Patagonia Norte. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas. Universidad Nacional del Comahue. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas; Argentina
Fil: Sommadossi, Silvana Andrea. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Patagonia Norte. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas. Universidad Nacional del Comahue. Instituto de Investigación y Desarrollo en Ingeniería de Procesos, Biotecnología y Energías Alternativas; Argentina
description New processes and materials are vital nowadays, since specific features of materials are essential to accomplish the more demanding technological and environmental requirements. Al/Ni system has stimulated a large number of phase equilibrium, thermodynamic, diffusion and related studies. Its relevance relays on first principle features as well as technological importance. Transient Liquid Phase Bonding (TLPB) process is presented in this work due to the advantages of this method above others. Low temperatures of processing are needed, to obtain stable intermetallic phases (IPs) suitable for high temperatures of service. The aim of this research is to investigate the impact of temperature on the IPs growth and formation mechanisms, completing previous works on microstructure and kinetics characterization of IPs in Al/Ni system at 720°C. The results of SEMEDS/ WDS analyses of the cross-sections of the bonds showed the presence of Al3Ni and Al3Ni2 at the beginning of the interaction between Al and Ni, which are consistent with the phase equilibrium diagram. The Al3Ni2 layer growth showed linear correlation with time at 800°C, whereas at 900 and 1000°C it suggested a diffusive growth. Inert markers experiments allowed distinguishing individual growth. Vickers micro-hardness was determined obtaining values for Ni and Al3Ni2 of about 100 and 800 HV/ 0.025, respectively.
publishDate 2012
dc.date.none.fl_str_mv 2012-04
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/269485
Tumminello, Silvana Deisy Paulina; Sommadossi, Silvana Andrea; Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System; Trans Tech Publications; Defect and Diffusion Forum; 323-325; 4-2012; 465-470
1662-9507
CONICET Digital
CONICET
url http://hdl.handle.net/11336/269485
identifier_str_mv Tumminello, Silvana Deisy Paulina; Sommadossi, Silvana Andrea; Growth Kinetics of Intermetallic Phases in Transient Liquid Phase Bonding Process (TLPB) in Al /Ni System; Trans Tech Publications; Defect and Diffusion Forum; 323-325; 4-2012; 465-470
1662-9507
CONICET Digital
CONICET
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/url/http://www.scientific.net/DDF.323-325.465
info:eu-repo/semantics/altIdentifier/doi/10.4028/www.scientific.net/DDF.323-325.465
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
application/pdf
dc.publisher.none.fl_str_mv Trans Tech Publications
publisher.none.fl_str_mv Trans Tech Publications
dc.source.none.fl_str_mv reponame:CONICET Digital (CONICET)
instname:Consejo Nacional de Investigaciones Científicas y Técnicas
reponame_str CONICET Digital (CONICET)
collection CONICET Digital (CONICET)
instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
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score 13.070432

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