Cita APA

De Leon, P., Albano, E., Salvarezza, R., & Solari, H. (2002). Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode. Web

Citación estilo Chicago

De Leon, P.F.J., E.V Albano, R.C Salvarezza, and H.G Solari. Interface Dynamics for Copper Electrodeposition: The Role of Organic Additives in the Growth Mode. 2002.

Cita MLA

De Leon, P.F.J., E.V Albano, R.C Salvarezza, and H.G Solari. Interface Dynamics for Copper Electrodeposition: The Role of Organic Additives in the Growth Mode. 2002.