The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics

Autores
Bolzán, Agustín E.; Wakenge, I. B.; Piatti, Roberto C. V.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
2001
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid was followed from open circuit potential measurements, voltammetry and rotating disk and ring-disk electrode data. The open circuit potential of copper is controlled by equilibria involving different Cu(I)–TU complex species. The thiourea electro-oxidation which yields formamidine disulphide and Cu(I)–TU complex species can be described as a process under intermediate kinetics taking place on a partially blocked copper anode. The degree of copper surface coverage and the type of predominant adsorbate depend on the concentration of thiourea and applied electric potential. Depending on the potential range adsorbates can be formed directly from either a strong TU–copper interaction or a relatively weaker formamidine disulphide interaction. The passivating layer can be related to the formation of polymer-like Cu(I)–TU layers and residues resulting both from thiourea and formamidine disulphide electro-oxidation. A previously proposed complex reaction pathway can explain the general behaviour of these systems, including adsorbate formation and the influence of the electrolyte solution constituents.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Facultad de Ciencias Exactas
Materia
Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by-nc-sa/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/82672

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oai_identifier_str oai:sedici.unlp.edu.ar:10915/82672
network_acronym_str SEDICI
repository_id_str 1329
network_name_str SEDICI (UNLP)
spelling The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kineticsBolzán, Agustín E.Wakenge, I. B.Piatti, Roberto C. V.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaCobreÁcidos SulfúricosElectroquímicaCinética químicaTioureaElectrólitosThe electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid was followed from open circuit potential measurements, voltammetry and rotating disk and ring-disk electrode data. The open circuit potential of copper is controlled by equilibria involving different Cu(I)–TU complex species. The thiourea electro-oxidation which yields formamidine disulphide and Cu(I)–TU complex species can be described as a process under intermediate kinetics taking place on a partially blocked copper anode. The degree of copper surface coverage and the type of predominant adsorbate depend on the concentration of thiourea and applied electric potential. Depending on the potential range adsorbates can be formed directly from either a strong TU–copper interaction or a relatively weaker formamidine disulphide interaction. The passivating layer can be related to the formation of polymer-like Cu(I)–TU layers and residues resulting both from thiourea and formamidine disulphide electro-oxidation. A previously proposed complex reaction pathway can explain the general behaviour of these systems, including adsorbate formation and the influence of the electrolyte solution constituents.Instituto de Investigaciones Fisicoquímicas Teóricas y AplicadasFacultad de Ciencias Exactas2001-03-23info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf241-252http://sedici.unlp.edu.ar/handle/10915/82672enginfo:eu-repo/semantics/altIdentifier/issn/1572-6657info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00535-0info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:15:36Zoai:sedici.unlp.edu.ar:10915/82672Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:15:37.178SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
spellingShingle The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
Bolzán, Agustín E.
Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
title_short The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_full The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_fullStr The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_full_unstemmed The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_sort The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
dc.creator.none.fl_str_mv Bolzán, Agustín E.
Wakenge, I. B.
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Bolzán, Agustín E.
author_facet Bolzán, Agustín E.
Wakenge, I. B.
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 Wakenge, I. B.
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
topic Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
dc.description.none.fl_txt_mv The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid was followed from open circuit potential measurements, voltammetry and rotating disk and ring-disk electrode data. The open circuit potential of copper is controlled by equilibria involving different Cu(I)–TU complex species. The thiourea electro-oxidation which yields formamidine disulphide and Cu(I)–TU complex species can be described as a process under intermediate kinetics taking place on a partially blocked copper anode. The degree of copper surface coverage and the type of predominant adsorbate depend on the concentration of thiourea and applied electric potential. Depending on the potential range adsorbates can be formed directly from either a strong TU–copper interaction or a relatively weaker formamidine disulphide interaction. The passivating layer can be related to the formation of polymer-like Cu(I)–TU layers and residues resulting both from thiourea and formamidine disulphide electro-oxidation. A previously proposed complex reaction pathway can explain the general behaviour of these systems, including adsorbate formation and the influence of the electrolyte solution constituents.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Facultad de Ciencias Exactas
description The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid was followed from open circuit potential measurements, voltammetry and rotating disk and ring-disk electrode data. The open circuit potential of copper is controlled by equilibria involving different Cu(I)–TU complex species. The thiourea electro-oxidation which yields formamidine disulphide and Cu(I)–TU complex species can be described as a process under intermediate kinetics taking place on a partially blocked copper anode. The degree of copper surface coverage and the type of predominant adsorbate depend on the concentration of thiourea and applied electric potential. Depending on the potential range adsorbates can be formed directly from either a strong TU–copper interaction or a relatively weaker formamidine disulphide interaction. The passivating layer can be related to the formation of polymer-like Cu(I)–TU layers and residues resulting both from thiourea and formamidine disulphide electro-oxidation. A previously proposed complex reaction pathway can explain the general behaviour of these systems, including adsorbate formation and the influence of the electrolyte solution constituents.
publishDate 2001
dc.date.none.fl_str_mv 2001-03-23
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/82672
url http://sedici.unlp.edu.ar/handle/10915/82672
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/1572-6657
info:eu-repo/semantics/altIdentifier/doi/10.1016/S0022-0728(00)00535-0
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
dc.format.none.fl_str_mv application/pdf
241-252
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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