Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
- Autores
- Figueroa, M. G.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
- Año de publicación
- 1986
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)ad monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)2 layer in equilibrium with Cu(SCN)−3(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas - Materia
-
Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by/4.0/
- Repositorio
- Institución
- Universidad Nacional de La Plata
- OAI Identificador
- oai:sedici.unlp.edu.ar:10915/119427
Ver los metadatos del registro completo
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Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processesFigueroa, M. G.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaCopperPotassium thiocyanateElectrochemical behaviourThe electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)<sub>ad</sub> monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)<sub>2</sub> layer in equilibrium with Cu(SCN)−<sub>3</sub>(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas1986info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf671-680http://sedici.unlp.edu.ar/handle/10915/119427enginfo:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(86)87034-7info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:28:10Zoai:sedici.unlp.edu.ar:10915/119427Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:28:10.765SEDICI (UNLP) - Universidad Nacional de La Platafalse |
dc.title.none.fl_str_mv |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes |
title |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes |
spellingShingle |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes Figueroa, M. G. Ciencias Exactas Química Copper Potassium thiocyanate Electrochemical behaviour |
title_short |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes |
title_full |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes |
title_fullStr |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes |
title_full_unstemmed |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes |
title_sort |
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes |
dc.creator.none.fl_str_mv |
Figueroa, M. G. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author |
Figueroa, M. G. |
author_facet |
Figueroa, M. G. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author_role |
author |
author2 |
Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author2_role |
author author |
dc.subject.none.fl_str_mv |
Ciencias Exactas Química Copper Potassium thiocyanate Electrochemical behaviour |
topic |
Ciencias Exactas Química Copper Potassium thiocyanate Electrochemical behaviour |
dc.description.none.fl_txt_mv |
The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)<sub>ad</sub> monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)<sub>2</sub> layer in equilibrium with Cu(SCN)−<sub>3</sub>(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas |
description |
The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)<sub>ad</sub> monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)<sub>2</sub> layer in equilibrium with Cu(SCN)−<sub>3</sub>(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN. |
publishDate |
1986 |
dc.date.none.fl_str_mv |
1986 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion Articulo http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://sedici.unlp.edu.ar/handle/10915/119427 |
url |
http://sedici.unlp.edu.ar/handle/10915/119427 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/issn/0013-4686 info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(86)87034-7 |
dc.rights.none.fl_str_mv |
info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
eu_rights_str_mv |
openAccess |
rights_invalid_str_mv |
http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
dc.format.none.fl_str_mv |
application/pdf 671-680 |
dc.source.none.fl_str_mv |
reponame:SEDICI (UNLP) instname:Universidad Nacional de La Plata instacron:UNLP |
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SEDICI (UNLP) |
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SEDICI (UNLP) |
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Universidad Nacional de La Plata |
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UNLP |
institution |
UNLP |
repository.name.fl_str_mv |
SEDICI (UNLP) - Universidad Nacional de La Plata |
repository.mail.fl_str_mv |
alira@sedici.unlp.edu.ar |
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13.070432 |