Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes

Autores
Figueroa, M. G.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
1986
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)ad monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)2 layer in equilibrium with Cu(SCN)−3(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Materia
Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/119427
Acceder
id SEDICI_d5cb5e65311aa2202b9542fb3dfe4b84
oai_identifier_str oai:sedici.unlp.edu.ar:10915/119427
network_acronym_str SEDICI
repository_id_str 1329
network_name_str SEDICI (UNLP)
spelling Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processesFigueroa, M. G.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaCopperPotassium thiocyanateElectrochemical behaviourThe electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)<sub>ad</sub> monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)<sub>2</sub> layer in equilibrium with Cu(SCN)−<sub>3</sub>(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas1986info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf671-680http://sedici.unlp.edu.ar/handle/10915/119427enginfo:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(86)87034-7info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-10-22T17:09:05Zoai:sedici.unlp.edu.ar:10915/119427Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-10-22 17:09:06.01SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
spellingShingle Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
Figueroa, M. G.
Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
title_short Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_full Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_fullStr Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_full_unstemmed Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_sort Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
dc.creator.none.fl_str_mv Figueroa, M. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Figueroa, M. G.
author_facet Figueroa, M. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
topic Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
dc.description.none.fl_txt_mv The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)<sub>ad</sub> monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)<sub>2</sub> layer in equilibrium with Cu(SCN)−<sub>3</sub>(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
description The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)<sub>ad</sub> monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)<sub>2</sub> layer in equilibrium with Cu(SCN)−<sub>3</sub>(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN.
publishDate 1986
dc.date.none.fl_str_mv 1986
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/119427
url http://sedici.unlp.edu.ar/handle/10915/119427
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/0013-4686
info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(86)87034-7
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
dc.format.none.fl_str_mv application/pdf
671-680
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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score 12.982451

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