Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions

Autores
Vela, María Elena; Andreasen, Gustavo; Aziz, S. G.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
1998
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The dynamics of Cu surfaces immersed in either aqueous HClO4 or H2SO4 solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm−2 an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10−2 M leads to the formation of a Cu2Cl2 layer.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Materia
Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/126571

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network_name_str SEDICI (UNLP)
spelling Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutionsVela, María ElenaAndreasen, GustavoAziz, S. G.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicascanning tunneling microscopyelectrodissolving copperThe dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm<sup>−2</sup> an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10<sup>−2</sup> M leads to the formation of a Cu<sub>2</sub>Cl<sub>2</sub> layer.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas1998info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf3-12http://sedici.unlp.edu.ar/handle/10915/126571enginfo:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/abs/pii/S0013468697002223info:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/S0013-4686(97)00222-3info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-03T11:02:34Zoai:sedici.unlp.edu.ar:10915/126571Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-03 11:02:34.84SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
spellingShingle Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
Vela, María Elena
Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper
title_short Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_full Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_fullStr Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_full_unstemmed Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_sort Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
dc.creator.none.fl_str_mv Vela, María Elena
Andreasen, Gustavo
Aziz, S. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Vela, María Elena
author_facet Vela, María Elena
Andreasen, Gustavo
Aziz, S. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 Andreasen, Gustavo
Aziz, S. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper
topic Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper
dc.description.none.fl_txt_mv The dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm<sup>−2</sup> an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10<sup>−2</sup> M leads to the formation of a Cu<sub>2</sub>Cl<sub>2</sub> layer.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
description The dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm<sup>−2</sup> an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10<sup>−2</sup> M leads to the formation of a Cu<sub>2</sub>Cl<sub>2</sub> layer.
publishDate 1998
dc.date.none.fl_str_mv 1998
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/126571
url http://sedici.unlp.edu.ar/handle/10915/126571
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/abs/pii/S0013468697002223
info:eu-repo/semantics/altIdentifier/issn/0013-4686
info:eu-repo/semantics/altIdentifier/doi/10.1016/S0013-4686(97)00222-3
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
dc.format.none.fl_str_mv application/pdf
3-12
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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