Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
- Autores
- Vela, María Elena; Andreasen, Gustavo; Aziz, S. G.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
- Año de publicación
- 1998
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- The dynamics of Cu surfaces immersed in either aqueous HClO4 or H2SO4 solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm−2 an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10−2 M leads to the formation of a Cu2Cl2 layer.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas - Materia
-
Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by/4.0/
- Repositorio
- Institución
- Universidad Nacional de La Plata
- OAI Identificador
- oai:sedici.unlp.edu.ar:10915/126571
Ver los metadatos del registro completo
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Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutionsVela, María ElenaAndreasen, GustavoAziz, S. G.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicascanning tunneling microscopyelectrodissolving copperThe dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm<sup>−2</sup> an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10<sup>−2</sup> M leads to the formation of a Cu<sub>2</sub>Cl<sub>2</sub> layer.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas1998info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf3-12http://sedici.unlp.edu.ar/handle/10915/126571enginfo:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/abs/pii/S0013468697002223info:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/S0013-4686(97)00222-3info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-03T11:02:34Zoai:sedici.unlp.edu.ar:10915/126571Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-03 11:02:34.84SEDICI (UNLP) - Universidad Nacional de La Platafalse |
dc.title.none.fl_str_mv |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions |
title |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions |
spellingShingle |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions Vela, María Elena Ciencias Exactas Química scanning tunneling microscopy electrodissolving copper |
title_short |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions |
title_full |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions |
title_fullStr |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions |
title_full_unstemmed |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions |
title_sort |
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions |
dc.creator.none.fl_str_mv |
Vela, María Elena Andreasen, Gustavo Aziz, S. G. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author |
Vela, María Elena |
author_facet |
Vela, María Elena Andreasen, Gustavo Aziz, S. G. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author_role |
author |
author2 |
Andreasen, Gustavo Aziz, S. G. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author2_role |
author author author author |
dc.subject.none.fl_str_mv |
Ciencias Exactas Química scanning tunneling microscopy electrodissolving copper |
topic |
Ciencias Exactas Química scanning tunneling microscopy electrodissolving copper |
dc.description.none.fl_txt_mv |
The dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm<sup>−2</sup> an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10<sup>−2</sup> M leads to the formation of a Cu<sub>2</sub>Cl<sub>2</sub> layer. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas |
description |
The dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm<sup>−2</sup> an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10<sup>−2</sup> M leads to the formation of a Cu<sub>2</sub>Cl<sub>2</sub> layer. |
publishDate |
1998 |
dc.date.none.fl_str_mv |
1998 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion Articulo http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://sedici.unlp.edu.ar/handle/10915/126571 |
url |
http://sedici.unlp.edu.ar/handle/10915/126571 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/abs/pii/S0013468697002223 info:eu-repo/semantics/altIdentifier/issn/0013-4686 info:eu-repo/semantics/altIdentifier/doi/10.1016/S0013-4686(97)00222-3 |
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info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
eu_rights_str_mv |
openAccess |
rights_invalid_str_mv |
http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
dc.format.none.fl_str_mv |
application/pdf 3-12 |
dc.source.none.fl_str_mv |
reponame:SEDICI (UNLP) instname:Universidad Nacional de La Plata instacron:UNLP |
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SEDICI (UNLP) - Universidad Nacional de La Plata |
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alira@sedici.unlp.edu.ar |
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