Influence of impurities in polygonization of fcc metals of low stacking fault energy
- Autores
- Bebczuk de Cusminsky, Juana; Niemela, E. T.
- Año de publicación
- 1977
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- Several studies performed on metal polygonization [1-3] indicate that impurities lock the dislocations and prevent their motion during a thermal treatment of previously deformed crystals. Nevertheless, the study made on polygonization of Cu showed contradictory results. Young [4, 5] and Wei et al. [6] observed polygonization in OFHC Cu, but not in 99.999% Cu, and pointed out that polygonization in Cu is very slow and occurs upon prolonged annealing at temperatures near the melting point. Seeger and Schoeck [7, 8] suggested that, in metals of low stacking fault energy like Cu, Ag and Au, the dislocations would be extended into widely separated partials, and thus climbing would be difficult. The fact that polygonization has been observed [4, 5] in OFHC Cu, but not in 99.999% Cu, was explained by considering that impurities tend to allow the partial dislocations to recombine. More recently, French workers [9 - 13], showed that pure Cu polygonizes more easily than impure. In order to clarify the effect of impurities in climbing of the extended dislocations in fcc metals, and to find the effect of the stacking fault energy, the present study was carried out in Cu and Ag crystals.
Laboratorio de Investigaciones de Metalurgia Física - Materia
-
Ingeniería en Materiales
fcc metal
impurities
metal polygonization - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by/4.0/
- Repositorio
- Institución
- Universidad Nacional de La Plata
- OAI Identificador
- oai:sedici.unlp.edu.ar:10915/134093
Ver los metadatos del registro completo
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Influence of impurities in polygonization of fcc metals of low stacking fault energyBebczuk de Cusminsky, JuanaNiemela, E. T.Ingeniería en Materialesfcc metalimpuritiesmetal polygonizationSeveral studies performed on metal polygonization [1-3] indicate that impurities lock the dislocations and prevent their motion during a thermal treatment of previously deformed crystals. Nevertheless, the study made on polygonization of Cu showed contradictory results. Young [4, 5] and Wei et al. [6] observed polygonization in OFHC Cu, but not in 99.999% Cu, and pointed out that polygonization in Cu is very slow and occurs upon prolonged annealing at temperatures near the melting point. Seeger and Schoeck [7, 8] suggested that, in metals of low stacking fault energy like Cu, Ag and Au, the dislocations would be extended into widely separated partials, and thus climbing would be difficult. The fact that polygonization has been observed [4, 5] in OFHC Cu, but not in 99.999% Cu, was explained by considering that impurities tend to allow the partial dislocations to recombine. More recently, French workers [9 - 13], showed that pure Cu polygonizes more easily than impure. In order to clarify the effect of impurities in climbing of the extended dislocations in fcc metals, and to find the effect of the stacking fault energy, the present study was carried out in Cu and Ag crystals.Laboratorio de Investigaciones de Metalurgia Física1977info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf1492-1494http://sedici.unlp.edu.ar/handle/10915/134093enginfo:eu-repo/semantics/altIdentifier/issn/0022-2461info:eu-repo/semantics/altIdentifier/issn/1573-4803info:eu-repo/semantics/altIdentifier/doi/10.1007/bf00540869info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:31:52Zoai:sedici.unlp.edu.ar:10915/134093Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:31:52.253SEDICI (UNLP) - Universidad Nacional de La Platafalse |
dc.title.none.fl_str_mv |
Influence of impurities in polygonization of fcc metals of low stacking fault energy |
title |
Influence of impurities in polygonization of fcc metals of low stacking fault energy |
spellingShingle |
Influence of impurities in polygonization of fcc metals of low stacking fault energy Bebczuk de Cusminsky, Juana Ingeniería en Materiales fcc metal impurities metal polygonization |
title_short |
Influence of impurities in polygonization of fcc metals of low stacking fault energy |
title_full |
Influence of impurities in polygonization of fcc metals of low stacking fault energy |
title_fullStr |
Influence of impurities in polygonization of fcc metals of low stacking fault energy |
title_full_unstemmed |
Influence of impurities in polygonization of fcc metals of low stacking fault energy |
title_sort |
Influence of impurities in polygonization of fcc metals of low stacking fault energy |
dc.creator.none.fl_str_mv |
Bebczuk de Cusminsky, Juana Niemela, E. T. |
author |
Bebczuk de Cusminsky, Juana |
author_facet |
Bebczuk de Cusminsky, Juana Niemela, E. T. |
author_role |
author |
author2 |
Niemela, E. T. |
author2_role |
author |
dc.subject.none.fl_str_mv |
Ingeniería en Materiales fcc metal impurities metal polygonization |
topic |
Ingeniería en Materiales fcc metal impurities metal polygonization |
dc.description.none.fl_txt_mv |
Several studies performed on metal polygonization [1-3] indicate that impurities lock the dislocations and prevent their motion during a thermal treatment of previously deformed crystals. Nevertheless, the study made on polygonization of Cu showed contradictory results. Young [4, 5] and Wei et al. [6] observed polygonization in OFHC Cu, but not in 99.999% Cu, and pointed out that polygonization in Cu is very slow and occurs upon prolonged annealing at temperatures near the melting point. Seeger and Schoeck [7, 8] suggested that, in metals of low stacking fault energy like Cu, Ag and Au, the dislocations would be extended into widely separated partials, and thus climbing would be difficult. The fact that polygonization has been observed [4, 5] in OFHC Cu, but not in 99.999% Cu, was explained by considering that impurities tend to allow the partial dislocations to recombine. More recently, French workers [9 - 13], showed that pure Cu polygonizes more easily than impure. In order to clarify the effect of impurities in climbing of the extended dislocations in fcc metals, and to find the effect of the stacking fault energy, the present study was carried out in Cu and Ag crystals. Laboratorio de Investigaciones de Metalurgia Física |
description |
Several studies performed on metal polygonization [1-3] indicate that impurities lock the dislocations and prevent their motion during a thermal treatment of previously deformed crystals. Nevertheless, the study made on polygonization of Cu showed contradictory results. Young [4, 5] and Wei et al. [6] observed polygonization in OFHC Cu, but not in 99.999% Cu, and pointed out that polygonization in Cu is very slow and occurs upon prolonged annealing at temperatures near the melting point. Seeger and Schoeck [7, 8] suggested that, in metals of low stacking fault energy like Cu, Ag and Au, the dislocations would be extended into widely separated partials, and thus climbing would be difficult. The fact that polygonization has been observed [4, 5] in OFHC Cu, but not in 99.999% Cu, was explained by considering that impurities tend to allow the partial dislocations to recombine. More recently, French workers [9 - 13], showed that pure Cu polygonizes more easily than impure. In order to clarify the effect of impurities in climbing of the extended dislocations in fcc metals, and to find the effect of the stacking fault energy, the present study was carried out in Cu and Ag crystals. |
publishDate |
1977 |
dc.date.none.fl_str_mv |
1977 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion Articulo http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://sedici.unlp.edu.ar/handle/10915/134093 |
url |
http://sedici.unlp.edu.ar/handle/10915/134093 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/issn/0022-2461 info:eu-repo/semantics/altIdentifier/issn/1573-4803 info:eu-repo/semantics/altIdentifier/doi/10.1007/bf00540869 |
dc.rights.none.fl_str_mv |
info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
eu_rights_str_mv |
openAccess |
rights_invalid_str_mv |
http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
dc.format.none.fl_str_mv |
application/pdf 1492-1494 |
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reponame:SEDICI (UNLP) instname:Universidad Nacional de La Plata instacron:UNLP |
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Universidad Nacional de La Plata |
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SEDICI (UNLP) - Universidad Nacional de La Plata |
repository.mail.fl_str_mv |
alira@sedici.unlp.edu.ar |
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1844616197987893248 |
score |
13.070432 |