Mendez, S., Andreasen, G., Schilardi, P. L., Figueroa, M., Vázquez, L., Salvarezza, R. C., & Arvia, A. J. (1998). Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging: Influence of a thiourea additive on the kinetics of roughening and brightening. Web
Citación estilo ChicagoMendez, S., Gustavo Andreasen, Patricia Laura Schilardi, M. Figueroa, L. Vázquez, Roberto Carlos Salvarezza, and Alejandro Jorge Arvia. Dynamic Scaling Exponents of Copper Electrodeposits From Scanning Force Microscopy Imaging: Influence of a Thiourea Additive On the Kinetics of Roughening and Brightening. 1998.
Cita MLAMendez, S., et al. Dynamic Scaling Exponents of Copper Electrodeposits From Scanning Force Microscopy Imaging: Influence of a Thiourea Additive On the Kinetics of Roughening and Brightening. 1998.