Early stages of copper electrodeposition on columnar structured platinum electrodes
- Autores
- Martins, María Elisa; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
- Año de publicación
- 1992
- Idioma
- inglés
- Tipo de recurso
- artículo
- Estado
- versión publicada
- Descripción
- The electrodeposition of Cu from diluted CuSO4 in 0.5 M H2SO4 on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu2+-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas - Materia
-
Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes - Nivel de accesibilidad
- acceso abierto
- Condiciones de uso
- http://creativecommons.org/licenses/by/4.0/
- Repositorio
- Institución
- Universidad Nacional de La Plata
- OAI Identificador
- oai:sedici.unlp.edu.ar:10915/119362
Ver los metadatos del registro completo
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Early stages of copper electrodeposition on columnar structured platinum electrodesMartins, María ElisaSalvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaElectrocrystallizationMetal electrodepositionElectrode roughnessGrowth modelsColumnar structured metal electrodesThe electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu<sup>2+</sup>-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas1992info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf2203-2207http://sedici.unlp.edu.ar/handle/10915/119362enginfo:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(92)85112-Xinfo:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:28:10Zoai:sedici.unlp.edu.ar:10915/119362Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:28:10.611SEDICI (UNLP) - Universidad Nacional de La Platafalse |
dc.title.none.fl_str_mv |
Early stages of copper electrodeposition on columnar structured platinum electrodes |
title |
Early stages of copper electrodeposition on columnar structured platinum electrodes |
spellingShingle |
Early stages of copper electrodeposition on columnar structured platinum electrodes Martins, María Elisa Ciencias Exactas Química Electrocrystallization Metal electrodeposition Electrode roughness Growth models Columnar structured metal electrodes |
title_short |
Early stages of copper electrodeposition on columnar structured platinum electrodes |
title_full |
Early stages of copper electrodeposition on columnar structured platinum electrodes |
title_fullStr |
Early stages of copper electrodeposition on columnar structured platinum electrodes |
title_full_unstemmed |
Early stages of copper electrodeposition on columnar structured platinum electrodes |
title_sort |
Early stages of copper electrodeposition on columnar structured platinum electrodes |
dc.creator.none.fl_str_mv |
Martins, María Elisa Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author |
Martins, María Elisa |
author_facet |
Martins, María Elisa Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author_role |
author |
author2 |
Salvarezza, Roberto Carlos Arvia, Alejandro Jorge |
author2_role |
author author |
dc.subject.none.fl_str_mv |
Ciencias Exactas Química Electrocrystallization Metal electrodeposition Electrode roughness Growth models Columnar structured metal electrodes |
topic |
Ciencias Exactas Química Electrocrystallization Metal electrodeposition Electrode roughness Growth models Columnar structured metal electrodes |
dc.description.none.fl_txt_mv |
The electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu<sup>2+</sup>-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas |
description |
The electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu<sup>2+</sup>-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5. |
publishDate |
1992 |
dc.date.none.fl_str_mv |
1992 |
dc.type.none.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion Articulo http://purl.org/coar/resource_type/c_6501 info:ar-repo/semantics/articulo |
format |
article |
status_str |
publishedVersion |
dc.identifier.none.fl_str_mv |
http://sedici.unlp.edu.ar/handle/10915/119362 |
url |
http://sedici.unlp.edu.ar/handle/10915/119362 |
dc.language.none.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
info:eu-repo/semantics/altIdentifier/issn/0013-4686 info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(92)85112-X |
dc.rights.none.fl_str_mv |
info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
eu_rights_str_mv |
openAccess |
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http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) |
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application/pdf 2203-2207 |
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SEDICI (UNLP) - Universidad Nacional de La Plata |
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