Early stages of copper electrodeposition on columnar structured platinum electrodes

Autores
Martins, María Elisa; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
1992
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The electrodeposition of Cu from diluted CuSO4 in 0.5 M H2SO4 on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu2+-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Materia
Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/119362
Acceder
id SEDICI_431167fc6ed01c7ca144f624cbc74557
oai_identifier_str oai:sedici.unlp.edu.ar:10915/119362
network_acronym_str SEDICI
repository_id_str 1329
network_name_str SEDICI (UNLP)
spelling Early stages of copper electrodeposition on columnar structured platinum electrodesMartins, María ElisaSalvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaElectrocrystallizationMetal electrodepositionElectrode roughnessGrowth modelsColumnar structured metal electrodesThe electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu<sup>2+</sup>-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas1992info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf2203-2207http://sedici.unlp.edu.ar/handle/10915/119362enginfo:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(92)85112-Xinfo:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-10-22T17:09:04Zoai:sedici.unlp.edu.ar:10915/119362Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-10-22 17:09:05.22SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Early stages of copper electrodeposition on columnar structured platinum electrodes
title Early stages of copper electrodeposition on columnar structured platinum electrodes
spellingShingle Early stages of copper electrodeposition on columnar structured platinum electrodes
Martins, María Elisa
Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
title_short Early stages of copper electrodeposition on columnar structured platinum electrodes
title_full Early stages of copper electrodeposition on columnar structured platinum electrodes
title_fullStr Early stages of copper electrodeposition on columnar structured platinum electrodes
title_full_unstemmed Early stages of copper electrodeposition on columnar structured platinum electrodes
title_sort Early stages of copper electrodeposition on columnar structured platinum electrodes
dc.creator.none.fl_str_mv Martins, María Elisa
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Martins, María Elisa
author_facet Martins, María Elisa
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
topic Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
dc.description.none.fl_txt_mv The electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu<sup>2+</sup>-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
description The electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu<sup>2+</sup>-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5.
publishDate 1992
dc.date.none.fl_str_mv 1992
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/119362
url http://sedici.unlp.edu.ar/handle/10915/119362
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/0013-4686
info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(92)85112-X
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
dc.format.none.fl_str_mv application/pdf
2203-2207
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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score 12.982451

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