Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution

Autores
Souto, Ricardo M.; González, Sergio G.; Salvarezza, Roberto Carlos; Arvia, Alejandro Jorge
Año de publicación
1994
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The electrochemical behaviour of Cu in alkaline solutions containing Na2SO4 was studied using potentiodynamic and potentiostatic techniques complemented by scanning electron microscopy. The presence of Na2SO4 enhances Cu electrodissolution through the passive layer and decreases the breakdown potential. There is a critical OH-/sulphate concentration ratio for the onset of localized corrosion. The competitive interaction between OH- and sulphate ions at the passive layer can explain the experimental data. Pit initiation fits the point defect model for passivity breakdown. Pit growth involves a number of current contributions which can be distinguished through the analysis of current transients at constant potential by using nucleation and growth models.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Facultad de Ciencias Exactas
Materia
Ciencias Exactas
Química
Cobre
Metales Alcalinos
Sulfatos
Sodio
scanning electron microscopy
electrodissolution
Cinética química
Electroquímica
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/86541

id SEDICI_3c46ff431df065be98c909ce0d0cc022
oai_identifier_str oai:sedici.unlp.edu.ar:10915/86541
network_acronym_str SEDICI
repository_id_str 1329
network_name_str SEDICI (UNLP)
spelling Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solutionSouto, Ricardo M.González, Sergio G.Salvarezza, Roberto CarlosArvia, Alejandro JorgeCiencias ExactasQuímicaCobreMetales AlcalinosSulfatosSodioscanning electron microscopyelectrodissolutionCinética químicaElectroquímicaThe electrochemical behaviour of Cu in alkaline solutions containing Na<sub>2</sub>SO<sub>4</sub> was studied using potentiodynamic and potentiostatic techniques complemented by scanning electron microscopy. The presence of Na<sub>2</sub>SO<sub>4</sub> enhances Cu electrodissolution through the passive layer and decreases the breakdown potential. There is a critical OH<sup>-</sup>/sulphate concentration ratio for the onset of localized corrosion. The competitive interaction between OH<sup>-</sup> and sulphate ions at the passive layer can explain the experimental data. Pit initiation fits the point defect model for passivity breakdown. Pit growth involves a number of current contributions which can be distinguished through the analysis of current transients at constant potential by using nucleation and growth models.Instituto de Investigaciones Fisicoquímicas Teóricas y AplicadasFacultad de Ciencias Exactas1994-12info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf2619-2628http://sedici.unlp.edu.ar/handle/10915/86541enginfo:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(94)00204-5info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-10-15T11:09:01Zoai:sedici.unlp.edu.ar:10915/86541Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-10-15 11:09:02.093SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
title Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
spellingShingle Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
Souto, Ricardo M.
Ciencias Exactas
Química
Cobre
Metales Alcalinos
Sulfatos
Sodio
scanning electron microscopy
electrodissolution
Cinética química
Electroquímica
title_short Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
title_full Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
title_fullStr Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
title_full_unstemmed Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
title_sort Kinetics of copper passivation and pitting corrosion in Na<sub>2</sub>SO<sub>4</sub> containing dilute NaOH aqueous solution
dc.creator.none.fl_str_mv Souto, Ricardo M.
González, Sergio G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author Souto, Ricardo M.
author_facet Souto, Ricardo M.
González, Sergio G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_role author
author2 González, Sergio G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author2_role author
author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Cobre
Metales Alcalinos
Sulfatos
Sodio
scanning electron microscopy
electrodissolution
Cinética química
Electroquímica
topic Ciencias Exactas
Química
Cobre
Metales Alcalinos
Sulfatos
Sodio
scanning electron microscopy
electrodissolution
Cinética química
Electroquímica
dc.description.none.fl_txt_mv The electrochemical behaviour of Cu in alkaline solutions containing Na<sub>2</sub>SO<sub>4</sub> was studied using potentiodynamic and potentiostatic techniques complemented by scanning electron microscopy. The presence of Na<sub>2</sub>SO<sub>4</sub> enhances Cu electrodissolution through the passive layer and decreases the breakdown potential. There is a critical OH<sup>-</sup>/sulphate concentration ratio for the onset of localized corrosion. The competitive interaction between OH<sup>-</sup> and sulphate ions at the passive layer can explain the experimental data. Pit initiation fits the point defect model for passivity breakdown. Pit growth involves a number of current contributions which can be distinguished through the analysis of current transients at constant potential by using nucleation and growth models.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Facultad de Ciencias Exactas
description The electrochemical behaviour of Cu in alkaline solutions containing Na<sub>2</sub>SO<sub>4</sub> was studied using potentiodynamic and potentiostatic techniques complemented by scanning electron microscopy. The presence of Na<sub>2</sub>SO<sub>4</sub> enhances Cu electrodissolution through the passive layer and decreases the breakdown potential. There is a critical OH<sup>-</sup>/sulphate concentration ratio for the onset of localized corrosion. The competitive interaction between OH<sup>-</sup> and sulphate ions at the passive layer can explain the experimental data. Pit initiation fits the point defect model for passivity breakdown. Pit growth involves a number of current contributions which can be distinguished through the analysis of current transients at constant potential by using nucleation and growth models.
publishDate 1994
dc.date.none.fl_str_mv 1994-12
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/86541
url http://sedici.unlp.edu.ar/handle/10915/86541
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/0013-4686
info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(94)00204-5
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
dc.format.none.fl_str_mv application/pdf
2619-2628
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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