Cita APA

Pasquale, M. Á., Gassa, L. M., & Arvia, A. J. (2008). Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives. Web

Citación estilo Chicago

Pasquale, Miguel Ángel, Liliana Mabel Gassa, and Alejandro Jorge Arvia. Copper Electrodeposition From an Acidic Plating Bath Containing Accelerating and Inhibiting Organic Additives. 2008.

Cita MLA

Pasquale, Miguel Ángel, Liliana Mabel Gassa, and Alejandro Jorge Arvia. Copper Electrodeposition From an Acidic Plating Bath Containing Accelerating and Inhibiting Organic Additives. 2008.