Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride

Autores
Gennero de Chialvo, Maria Rosa; Salvarezza, Roberto Carlos; Vásquez Moll, Victor Dennis; Arvia, Alejandro Jorge
Año de publicación
1985
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
The pitting corrosion of copper in borate buffer containing sodium chloride is studied by using potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The breakdown potential shifts towards more negative values as the sodium chloride concentration increases. During pitting both soluble Cu(I) and Cu(II) species are detected. The first stage of pitting is explained through the competition between the passive layer formation and the nucleation and growth of the CuCl layer in equilibrium with Cu(I)-chloride complexes in solution. When salt nuclei reach the metal surface, pit growth under charge-transfer control is found. In the following stage the kinetics of pit growth changes to a diffusion controlled process when the thick CuCl layer is completed. Secondary breakdown of the salt layer results in copper dissolution through Cu(II) soluble species. The corresponding overall process is discussed in terms of a sum of nucleation and growth processes. The reaction model reproduces the potentiostatic current transients of copper in weakly alkaline borate buffer containing sodium chloride.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas (INIFTA)
Facultad de Ciencias Exactas
Materia
Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by-nc-sa/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/79490
Acceder
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oai_identifier_str oai:sedici.unlp.edu.ar:10915/79490
network_acronym_str SEDICI
repository_id_str 1329
network_name_str SEDICI (UNLP)
spelling Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chlorideGennero de Chialvo, Maria RosaSalvarezza, Roberto CarlosVásquez Moll, Victor DennisArvia, Alejandro JorgeCiencias ExactasQuímicaCinética químicaCorrosiónCloruro de SodioElectrónpitting corrosionCobreThe pitting corrosion of copper in borate buffer containing sodium chloride is studied by using potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The breakdown potential shifts towards more negative values as the sodium chloride concentration increases. During pitting both soluble Cu(I) and Cu(II) species are detected. The first stage of pitting is explained through the competition between the passive layer formation and the nucleation and growth of the CuCl layer in equilibrium with Cu(I)-chloride complexes in solution. When salt nuclei reach the metal surface, pit growth under charge-transfer control is found. In the following stage the kinetics of pit growth changes to a diffusion controlled process when the thick CuCl layer is completed. Secondary breakdown of the salt layer results in copper dissolution through Cu(II) soluble species. The corresponding overall process is discussed in terms of a sum of nucleation and growth processes. The reaction model reproduces the potentiostatic current transients of copper in weakly alkaline borate buffer containing sodium chloride.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas (INIFTA)Facultad de Ciencias Exactas1985-11info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf1501-1511http://sedici.unlp.edu.ar/handle/10915/79490enginfo:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(85)80012-8info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by-nc-sa/4.0/Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-10-15T11:06:20Zoai:sedici.unlp.edu.ar:10915/79490Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-10-15 11:06:20.421SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
spellingShingle Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
Gennero de Chialvo, Maria Rosa
Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
title_short Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_full Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_fullStr Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_full_unstemmed Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_sort Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
dc.creator.none.fl_str_mv Gennero de Chialvo, Maria Rosa
Salvarezza, Roberto Carlos
Vásquez Moll, Victor Dennis
Arvia, Alejandro Jorge
author Gennero de Chialvo, Maria Rosa
author_facet Gennero de Chialvo, Maria Rosa
Salvarezza, Roberto Carlos
Vásquez Moll, Victor Dennis
Arvia, Alejandro Jorge
author_role author
author2 Salvarezza, Roberto Carlos
Vásquez Moll, Victor Dennis
Arvia, Alejandro Jorge
author2_role author
author
author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
topic Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
dc.description.none.fl_txt_mv The pitting corrosion of copper in borate buffer containing sodium chloride is studied by using potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The breakdown potential shifts towards more negative values as the sodium chloride concentration increases. During pitting both soluble Cu(I) and Cu(II) species are detected. The first stage of pitting is explained through the competition between the passive layer formation and the nucleation and growth of the CuCl layer in equilibrium with Cu(I)-chloride complexes in solution. When salt nuclei reach the metal surface, pit growth under charge-transfer control is found. In the following stage the kinetics of pit growth changes to a diffusion controlled process when the thick CuCl layer is completed. Secondary breakdown of the salt layer results in copper dissolution through Cu(II) soluble species. The corresponding overall process is discussed in terms of a sum of nucleation and growth processes. The reaction model reproduces the potentiostatic current transients of copper in weakly alkaline borate buffer containing sodium chloride.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas (INIFTA)
Facultad de Ciencias Exactas
description The pitting corrosion of copper in borate buffer containing sodium chloride is studied by using potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The breakdown potential shifts towards more negative values as the sodium chloride concentration increases. During pitting both soluble Cu(I) and Cu(II) species are detected. The first stage of pitting is explained through the competition between the passive layer formation and the nucleation and growth of the CuCl layer in equilibrium with Cu(I)-chloride complexes in solution. When salt nuclei reach the metal surface, pit growth under charge-transfer control is found. In the following stage the kinetics of pit growth changes to a diffusion controlled process when the thick CuCl layer is completed. Secondary breakdown of the salt layer results in copper dissolution through Cu(II) soluble species. The corresponding overall process is discussed in terms of a sum of nucleation and growth processes. The reaction model reproduces the potentiostatic current transients of copper in weakly alkaline borate buffer containing sodium chloride.
publishDate 1985
dc.date.none.fl_str_mv 1985-11
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/79490
url http://sedici.unlp.edu.ar/handle/10915/79490
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(85)80012-8
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by-nc-sa/4.0/
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
dc.format.none.fl_str_mv application/pdf
1501-1511
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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score 13.22299

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