Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes

Autores
Bazán, Julio César; Arvia, Alejandro Jorge
Año de publicación
1964
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Ionic mass transfer for the electrodeposition of copper from aqueous copper sulphate-sulphuric acid solutions has been studied on tubular stainless steel electrodes. The following parameters were varied: rate of flow, copper ion concentration, viscosity, height and diameter of tubular electrodes, and temperature. The data can be correlated by the dimensionless equation Sh = 0·647 Re1/2Sc1/3. The temperature coefficient of the kinetic mass-transfer constant is 1.2, corresponding to an experimental heat of activation of 3850 ± 200 cal/mol. The solution of the momentum- and heat-transfer equations worked out by Eckert for flat plates, according to von Kármán's treatment, and recently extended by Wranglén to the analogous masstransfer problem, can be applied under certain conditions to tubular electrodes.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Materia
Ciencias Exactas
Química
Ionic mass transfer
Copper
Electrodeposition
Nivel de accesibilidad
acceso abierto
Condiciones de uso
http://creativecommons.org/licenses/by/4.0/
Repositorio
SEDICI (UNLP)
Institución
Universidad Nacional de La Plata
OAI Identificador
oai:sedici.unlp.edu.ar:10915/121420
Acceder
id SEDICI_0c92e2202f45e1ae19b1211448021a42
oai_identifier_str oai:sedici.unlp.edu.ar:10915/121420
network_acronym_str SEDICI
repository_id_str 1329
network_name_str SEDICI (UNLP)
spelling Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodesBazán, Julio CésarArvia, Alejandro JorgeCiencias ExactasQuímicaIonic mass transferCopperElectrodepositionIonic mass transfer for the electrodeposition of copper from aqueous copper sulphate-sulphuric acid solutions has been studied on tubular stainless steel electrodes. The following parameters were varied: rate of flow, copper ion concentration, viscosity, height and diameter of tubular electrodes, and temperature. The data can be correlated by the dimensionless equation Sh = 0·647 Re<sup>1/2</sup>Sc<sup>1/3</sup>. The temperature coefficient of the kinetic mass-transfer constant is 1.2, corresponding to an experimental heat of activation of 3850 ± 200 cal/mol. The solution of the momentum- and heat-transfer equations worked out by Eckert for flat plates, according to von Kármán's treatment, and recently extended by Wranglén to the analogous masstransfer problem, can be applied under certain conditions to tubular electrodes.Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas1964info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionArticulohttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdf17-30http://sedici.unlp.edu.ar/handle/10915/121420enginfo:eu-repo/semantics/altIdentifier/issn/0013-4686info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(64)80002-5info:eu-repo/semantics/openAccesshttp://creativecommons.org/licenses/by/4.0/Creative Commons Attribution 4.0 International (CC BY 4.0)reponame:SEDICI (UNLP)instname:Universidad Nacional de La Platainstacron:UNLP2025-09-29T11:28:49Zoai:sedici.unlp.edu.ar:10915/121420Institucionalhttp://sedici.unlp.edu.ar/Universidad públicaNo correspondehttp://sedici.unlp.edu.ar/oai/snrdalira@sedici.unlp.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:13292025-09-29 11:28:49.59SEDICI (UNLP) - Universidad Nacional de La Platafalse
dc.title.none.fl_str_mv Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
title Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
spellingShingle Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
Bazán, Julio César
Ciencias Exactas
Química
Ionic mass transfer
Copper
Electrodeposition
title_short Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
title_full Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
title_fullStr Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
title_full_unstemmed Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
title_sort Ionic mass transfer in the electrolysis of flowing solutions : The electrodeposition of copper under mass-transfer control on tubular electrodes
dc.creator.none.fl_str_mv Bazán, Julio César
Arvia, Alejandro Jorge
author Bazán, Julio César
author_facet Bazán, Julio César
Arvia, Alejandro Jorge
author_role author
author2 Arvia, Alejandro Jorge
author2_role author
dc.subject.none.fl_str_mv Ciencias Exactas
Química
Ionic mass transfer
Copper
Electrodeposition
topic Ciencias Exactas
Química
Ionic mass transfer
Copper
Electrodeposition
dc.description.none.fl_txt_mv Ionic mass transfer for the electrodeposition of copper from aqueous copper sulphate-sulphuric acid solutions has been studied on tubular stainless steel electrodes. The following parameters were varied: rate of flow, copper ion concentration, viscosity, height and diameter of tubular electrodes, and temperature. The data can be correlated by the dimensionless equation Sh = 0·647 Re<sup>1/2</sup>Sc<sup>1/3</sup>. The temperature coefficient of the kinetic mass-transfer constant is 1.2, corresponding to an experimental heat of activation of 3850 ± 200 cal/mol. The solution of the momentum- and heat-transfer equations worked out by Eckert for flat plates, according to von Kármán's treatment, and recently extended by Wranglén to the analogous masstransfer problem, can be applied under certain conditions to tubular electrodes.
Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
description Ionic mass transfer for the electrodeposition of copper from aqueous copper sulphate-sulphuric acid solutions has been studied on tubular stainless steel electrodes. The following parameters were varied: rate of flow, copper ion concentration, viscosity, height and diameter of tubular electrodes, and temperature. The data can be correlated by the dimensionless equation Sh = 0·647 Re<sup>1/2</sup>Sc<sup>1/3</sup>. The temperature coefficient of the kinetic mass-transfer constant is 1.2, corresponding to an experimental heat of activation of 3850 ± 200 cal/mol. The solution of the momentum- and heat-transfer equations worked out by Eckert for flat plates, according to von Kármán's treatment, and recently extended by Wranglén to the analogous masstransfer problem, can be applied under certain conditions to tubular electrodes.
publishDate 1964
dc.date.none.fl_str_mv 1964
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
Articulo
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://sedici.unlp.edu.ar/handle/10915/121420
url http://sedici.unlp.edu.ar/handle/10915/121420
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/issn/0013-4686
info:eu-repo/semantics/altIdentifier/doi/10.1016/0013-4686(64)80002-5
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
eu_rights_str_mv openAccess
rights_invalid_str_mv http://creativecommons.org/licenses/by/4.0/
Creative Commons Attribution 4.0 International (CC BY 4.0)
dc.format.none.fl_str_mv application/pdf
17-30
dc.source.none.fl_str_mv reponame:SEDICI (UNLP)
instname:Universidad Nacional de La Plata
instacron:UNLP
reponame_str SEDICI (UNLP)
collection SEDICI (UNLP)
instname_str Universidad Nacional de La Plata
instacron_str UNLP
institution UNLP
repository.name.fl_str_mv SEDICI (UNLP) - Universidad Nacional de La Plata
repository.mail.fl_str_mv alira@sedici.unlp.edu.ar
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score 13.070432

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