Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding

Autores
Di Luozzo, Nicolás; Boudard, Miguel Santiago; Fontana, Marcelo; Arcondo, Bibiana
Año de publicación
2016
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Seamless carbon steel tubes were joined by the transient liquid phase (TLP) bonding process using Cu foilsas interlayers. Bonding was performed at 1300 °C for 7 min with an applied uniaxial pressure of 5 MPa. Thecompletion of isothermal solidification was not systematically achieved along the joint, leading to the presenceof athermally solidified liquid (ASL). Consequently, the ability to predict the time to complete isothermalsolidification ? and therefore its kinetics ? is of great interest. For this purpose, a one-dimensional modelusing the finite element method was employed to simulate the TLP bonding. In particular, regions where thecompletion of the process was not achieved provided a source for the effective diffusion coefficient (Def) forthe bonding process. By knowing Def, different cases were considered within the proposed model, from theremaining time to complete the bonding process for an observed ASL, to the maximum liquid gap that can beisothermally solidified for a selected holding time. The validity of the utilization of Def was confirmed by analysingthe diffusion kinetic regime of Cu in steel.
Fil: Di Luozzo, Nicolás. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; Argentina
Fil: Boudard, Miguel Santiago. Centre National de la Recherche Scientifique; Francia
Fil: Fontana, Marcelo. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; Argentina
Fil: Arcondo, Bibiana. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; Argentina
Materia
Stee
Ltransient Liquid Phase Bonding
Isothermal Solidification
Finite-Element Simulation
Diffusion Kinetic Regime
Nivel de accesibilidad
acceso abierto
Condiciones de uso
https://creativecommons.org/licenses/by-nc-nd/2.5/ar/
Repositorio
CONICET Digital (CONICET)
Institución
Consejo Nacional de Investigaciones Científicas y Técnicas
OAI Identificador
oai:ri.conicet.gov.ar:11336/47217
Acceder
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oai_identifier_str oai:ri.conicet.gov.ar:11336/47217
network_acronym_str CONICETDig
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network_name_str CONICET Digital (CONICET)
spelling Effective diffusion coefficient for Cu in steel joined by transient liquid phase bondingDi Luozzo, NicolásBoudard, Miguel SantiagoFontana, MarceloArcondo, BibianaSteeLtransient Liquid Phase BondingIsothermal SolidificationFinite-Element SimulationDiffusion Kinetic Regimehttps://purl.org/becyt/ford/2.5https://purl.org/becyt/ford/2Seamless carbon steel tubes were joined by the transient liquid phase (TLP) bonding process using Cu foilsas interlayers. Bonding was performed at 1300 °C for 7 min with an applied uniaxial pressure of 5 MPa. Thecompletion of isothermal solidification was not systematically achieved along the joint, leading to the presenceof athermally solidified liquid (ASL). Consequently, the ability to predict the time to complete isothermalsolidification ? and therefore its kinetics ? is of great interest. For this purpose, a one-dimensional modelusing the finite element method was employed to simulate the TLP bonding. In particular, regions where thecompletion of the process was not achieved provided a source for the effective diffusion coefficient (Def) forthe bonding process. By knowing Def, different cases were considered within the proposed model, from theremaining time to complete the bonding process for an observed ASL, to the maximum liquid gap that can beisothermally solidified for a selected holding time. The validity of the utilization of Def was confirmed by analysingthe diffusion kinetic regime of Cu in steel.Fil: Di Luozzo, Nicolás. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; ArgentinaFil: Boudard, Miguel Santiago. Centre National de la Recherche Scientifique; FranciaFil: Fontana, Marcelo. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; ArgentinaFil: Arcondo, Bibiana. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; ArgentinaElsevier2016-02info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloapplication/pdfapplication/pdfapplication/pdfhttp://hdl.handle.net/11336/47217Di Luozzo, Nicolás; Boudard, Miguel Santiago; Fontana, Marcelo; Arcondo, Bibiana; Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding; Elsevier; Materials & Design; 92; 2-2016; 760-7660264-1275CONICET DigitalCONICETenginfo:eu-repo/semantics/altIdentifier/doi/10.1016/j.matdes.2015.12.101info:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/pii/S0264127515309618info:eu-repo/semantics/openAccesshttps://creativecommons.org/licenses/by-nc-nd/2.5/ar/reponame:CONICET Digital (CONICET)instname:Consejo Nacional de Investigaciones Científicas y Técnicas2025-09-29T09:55:10Zoai:ri.conicet.gov.ar:11336/47217instacron:CONICETInstitucionalhttp://ri.conicet.gov.ar/Organismo científico-tecnológicoNo correspondehttp://ri.conicet.gov.ar/oai/requestdasensio@conicet.gov.ar; lcarlino@conicet.gov.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:34982025-09-29 09:55:10.654CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicasfalse
dc.title.none.fl_str_mv Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
title Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
spellingShingle Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
Di Luozzo, Nicolás
Stee
Ltransient Liquid Phase Bonding
Isothermal Solidification
Finite-Element Simulation
Diffusion Kinetic Regime
title_short Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
title_full Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
title_fullStr Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
title_full_unstemmed Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
title_sort Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding
dc.creator.none.fl_str_mv Di Luozzo, Nicolás
Boudard, Miguel Santiago
Fontana, Marcelo
Arcondo, Bibiana
author Di Luozzo, Nicolás
author_facet Di Luozzo, Nicolás
Boudard, Miguel Santiago
Fontana, Marcelo
Arcondo, Bibiana
author_role author
author2 Boudard, Miguel Santiago
Fontana, Marcelo
Arcondo, Bibiana
author2_role author
author
author
dc.subject.none.fl_str_mv Stee
Ltransient Liquid Phase Bonding
Isothermal Solidification
Finite-Element Simulation
Diffusion Kinetic Regime
topic Stee
Ltransient Liquid Phase Bonding
Isothermal Solidification
Finite-Element Simulation
Diffusion Kinetic Regime
purl_subject.fl_str_mv https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
dc.description.none.fl_txt_mv Seamless carbon steel tubes were joined by the transient liquid phase (TLP) bonding process using Cu foilsas interlayers. Bonding was performed at 1300 °C for 7 min with an applied uniaxial pressure of 5 MPa. Thecompletion of isothermal solidification was not systematically achieved along the joint, leading to the presenceof athermally solidified liquid (ASL). Consequently, the ability to predict the time to complete isothermalsolidification ? and therefore its kinetics ? is of great interest. For this purpose, a one-dimensional modelusing the finite element method was employed to simulate the TLP bonding. In particular, regions where thecompletion of the process was not achieved provided a source for the effective diffusion coefficient (Def) forthe bonding process. By knowing Def, different cases were considered within the proposed model, from theremaining time to complete the bonding process for an observed ASL, to the maximum liquid gap that can beisothermally solidified for a selected holding time. The validity of the utilization of Def was confirmed by analysingthe diffusion kinetic regime of Cu in steel.
Fil: Di Luozzo, Nicolás. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; Argentina
Fil: Boudard, Miguel Santiago. Centre National de la Recherche Scientifique; Francia
Fil: Fontana, Marcelo. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; Argentina
Fil: Arcondo, Bibiana. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long". Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnologías y Ciencias de la Ingeniería "Hilario Fernández Long"; Argentina
description Seamless carbon steel tubes were joined by the transient liquid phase (TLP) bonding process using Cu foilsas interlayers. Bonding was performed at 1300 °C for 7 min with an applied uniaxial pressure of 5 MPa. Thecompletion of isothermal solidification was not systematically achieved along the joint, leading to the presenceof athermally solidified liquid (ASL). Consequently, the ability to predict the time to complete isothermalsolidification ? and therefore its kinetics ? is of great interest. For this purpose, a one-dimensional modelusing the finite element method was employed to simulate the TLP bonding. In particular, regions where thecompletion of the process was not achieved provided a source for the effective diffusion coefficient (Def) forthe bonding process. By knowing Def, different cases were considered within the proposed model, from theremaining time to complete the bonding process for an observed ASL, to the maximum liquid gap that can beisothermally solidified for a selected holding time. The validity of the utilization of Def was confirmed by analysingthe diffusion kinetic regime of Cu in steel.
publishDate 2016
dc.date.none.fl_str_mv 2016-02
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/11336/47217
Di Luozzo, Nicolás; Boudard, Miguel Santiago; Fontana, Marcelo; Arcondo, Bibiana; Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding; Elsevier; Materials & Design; 92; 2-2016; 760-766
0264-1275
CONICET Digital
CONICET
url http://hdl.handle.net/11336/47217
identifier_str_mv Di Luozzo, Nicolás; Boudard, Miguel Santiago; Fontana, Marcelo; Arcondo, Bibiana; Effective diffusion coefficient for Cu in steel joined by transient liquid phase bonding; Elsevier; Materials & Design; 92; 2-2016; 760-766
0264-1275
CONICET Digital
CONICET
dc.language.none.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv info:eu-repo/semantics/altIdentifier/doi/10.1016/j.matdes.2015.12.101
info:eu-repo/semantics/altIdentifier/url/https://www.sciencedirect.com/science/article/pii/S0264127515309618
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
https://creativecommons.org/licenses/by-nc-nd/2.5/ar/
eu_rights_str_mv openAccess
rights_invalid_str_mv https://creativecommons.org/licenses/by-nc-nd/2.5/ar/
dc.format.none.fl_str_mv application/pdf
application/pdf
application/pdf
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
dc.source.none.fl_str_mv reponame:CONICET Digital (CONICET)
instname:Consejo Nacional de Investigaciones Científicas y Técnicas
reponame_str CONICET Digital (CONICET)
collection CONICET Digital (CONICET)
instname_str Consejo Nacional de Investigaciones Científicas y Técnicas
repository.name.fl_str_mv CONICET Digital (CONICET) - Consejo Nacional de Investigaciones Científicas y Técnicas
repository.mail.fl_str_mv dasensio@conicet.gov.ar; lcarlino@conicet.gov.ar
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score 13.070432

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