Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques

Autores
Mahmud, Z.; Gordillo, G.; Gassa, L.; Ventura D'Alkaine, C.
Año de publicación
2016
Idioma
español
Tipo de recurso
informe técnico
Estado
Versión enviada para evaluación y publicación
Descripción
In this work we have analyzed the effect of thiourea concentration in the acid zinc deposition process. For these purpose, we have used the electrochemical techniques (cathodic voltammetry and Electrochemistry Impedance Spectroscopy, EIS). It allows determining the optimal concentration thiourea additive. In this range, we have obtained better finishes, more refined and decoratives layers. We have found in voltammetric studies that the electroreduction of Zn 2+ in the presence of thiourea is accelerated. The EIS studies has shown the “electrodeposition resistance” decrease in the presence of thiourea. The addition of more thiourea in the solution, in the optimum concentration, the electrodeposition resistance to the electrodeposition process is increased. The main contribution of this research and its scientific contribution is the use of electrochemical techniques for determining the optimal concentration of thiourea additive in the zinc electroplating solution in chloride acid media
Fil:Mahmud, Z. Instituto Nacional de Tecnología Industrial (INTI). Procesos Superficiales
Fil:Gordillo, G. Universidad de Buenos Aires (UBA). Facultad de Ciencias Exactas y Naturales. Departamento de Química Inorgánica, Analítica y Química Física
Fil:Gassa, L. Universidad Nacional de La Plata (UNLP). Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas
Fil:Ventura D'Alkaine, C. Universidade Federal de São Carlos (UFSCar)
Materia
zinc
electroplating
additives
EIS
Nivel de accesibilidad
Acceso abierto
Licencia
http://creativecommons.org/licenses/by/2.5/ar
Repositorio
Biblioteca Digital (UBA-FCEN)
Institución
Universidad Nacional de Buenos Aires. Facultad de Ciencias Exactas y Naturales
OAI Identificador
snrd:technicalreport_00014